IZM FraunhoferInstitut Zuverlässigkeit und...

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Fraunhofer Institute Reliability and Microintegration

Polytronic Systems Department - Munich

K. Bock 10. Europ. Elektroniktechn.-Kolleg, Mallorca 2007

FraunhoferIZM

Institut Zuverlässigkeit und Mikrointegration

Institutsteil München

Large area cost-efficient electronics integration.“Flexible Substrate – Polytronische Systeme“

Karlheinz BockFraunhofer Institute for Reliability and MicrointegrationHansastr. 27d, D-80686 Munich, Germany, karlheinz.bock@izm-m.fraunhofer.de

Outline

• Introduction• Plastics Electronics manufactured in Roll to roll (reel to reel)• Performance and Technology Integration• Silicon does not sleep• Micro-Systems in R2R – Smart Plastics• Outview

Artist visionSource Fraunhofer

Moore‘s Law

Through-Hole Wave

1970 1980 1990 2000 2010

Area Array Wave

Surface-Mount Wave

PackagingGap

100000

1000000

Hetero SystemIntegration Wave

HDI - Wave

Electronic Systems Packaging Technology Waves

Polymers – basic material for future electronics & systems?

substrates and interconnects

transistors and ICs, memory

sensors and aktuators MEMS

Power - batteries and solar cells

Displays, lighting, signage

Packaging and housing

Media connections - fluidics pneumatics...

In-Line Processes Reel to Reel, or sheet

⇒ Complete systems based on most-Polymers

Polytronic Systems pictures: FhG-IAP. FhG-IPMS, FhG-IZM, Power Paper Ltd.

Flexible Substrates & Large Area ?

• For production reasons– Substrate handling, large volume, – Material efficiency

• Add to existing production processes– Free form factor for final product– In-line integration in end product– Surface integration

• The end product is to be flexible– Reliable & Ruggedized, shatterproof– Thin & rollable, – Wearable & light weight,

Artist view Fraunhofer Journal

Summary of Process Targets for Large Area Electronics

• Small critical dimension (lithography) channel length

• high yield, higher integration scale

• better reproducibility small variation in FET performance

• good conductive wiring (thin metals) better interconnection

• antenna integration for wireless communication of

ubiqitious systems (RFId, ambient intelligence)

What price.... PrIntegrated Circuit

• Resolution of mass printing has to reach <10 μm (now100μm), Registration has also to improve, but not so significantly as compared to resolution

• Material properties like conductivity and mobilityhave to improve by a factor of 10-100 to be able to massprint electrically operational circuits

• Structurization accuracy (d structure / d roughness) has to improve by a factor of 100

• Thickness of mass printed dielectric can only be reducedto <1μm if first two requirements are not reached, because of electrical and geometrical limitations.

High Density Interconnect Technology

Waferlevel HDI with integratedThin (20µm) Si Chips and 5µm Cu routing

Processed layers : µmMetal 4 Ni contact pads 10Dielectric 3 PI passivation 20Metal 3 Cu routing 5Dielectric 2 Polyimide 20Metal 2 Cu routing 5Dielectric 1 Polyimide 20Metal 1 Ni contact pads 10Separation Thermoplast 10Mech. Carrier Si-Monitorwafer 520

Focus of IZM Development

evaporation

small molecules

solvent based

polymer

very low-cost

Sensor networks

large area

display driver

digital processed

end-user electronic

sheets

coating process application field manufacturing

Dimensional Accuracy of Copper Patterning

dimensional accuracydepends on- mask quality- resist process- etching process

dependent on gap to nextstructure

after lithograpyafter etching

0 25 50 75 100

distance to next pattern [μm]

Development of fine pitch substrates using R2R

• Subtractive and semiadditive processes developed

• Subtractive technique: Only for thin metal layers and/or regular pattern applicableSmall single lines with large distance to next structure should be avoided

• Semiadditive technique:Dry fotoresist DuPont MX5015, thickness 15μmSubstrate: metallized polyimide tape with 1μm CuLimit of pattern resolution corresponds strongly to photoresist thickness with an aspect ratio of ca. 1 ⇒ minimal lines and spaces of ca. 15μm

40μm pitch 30μm

Semiadditive technique, Cu thickness ca. 6μm

SHIFT - IST 507745 Smart High-Integration Flex Technologies

Second conductor layer by screen printing

screen printed lines crossing Cu lines test sheet 200x200 mm²

• Minimal lines and spaces of first Cu layer: 15μm

• Minimal lines and spaces of printed second layer: 200μm

• Also 50μm via openings show contact between both layers

UV-Lithography

mask alignment

UV exposure

spoolerdespooler

etch unit

resist striprinse

dryerrinse

Reel-to-Reel Application Center - Equipment

Summary: Reel-to-Reel Manufacturing of Polymer Electronics

• All Processes can be done from Roll to Roll

• UV-lithography, blading of OSC, gate isolation , screen print gate conductor, via and interconnect

• Patterning Steps are done in stop&go with 200 mm steps

polymer-FET

coppersubstratesubstrate

gate conductorprintedgate conductorprintedvia

gate dielectricbladedgate dielectricbladed

semicond. polymerbladedsemicond. polymerbladed

copperwet-etchedcopperwet-etched

via openedwith solventvia openedwith solvent

top wiringprintedtop wiringprinted

multilayerdielectricprinted

Automatised Test Equipment

Reel-to-reel test equipped withsoftware controlled patternrecognition and measurement

Needle probe for device characterization withKeithley parameter analyzer (4 SMUs)

• Setup for measurement

Bode plot flexible OFET SD 40μm

1kHz 10kHz 100kHz 1MHz

Frequency [Hz]

Dynamic Behavior of Polymer TFT

process & device performance data see following presentation of G.Klink

Development of a polymer temperature sensor in Roll to Roll

Sensor circuit

Temperature threshold discrimination

20 40 60 80 10048

Temperature (°C)

output 1 output 2

Selection of a material with positive and a material with negative temperature coefficient allows realisation of the temperature sensor

Integration of Polymer Electronics to Systems

•Antennae

etched copper printed silver

•Fused ROM for Memory

copperconductortripped bycurrent pulse

•Logic Circuits

layout for a small scale integrated

logic polymer circuit•Encapsulation

y = -0,0006x + 1,0083

0 20 40 60 80 100 120storage time 35°C/85%rH

Measurement of transistordegradation in humid environment

Differential amplifier – Interface to sensors

Schematics Comparator

Layout

Circuit

Polymer System Integration needs analog-digital interface for sensors

Design, layout and processing finished, device in evaluation

Ultra Thin Silicon

Technologies for Flexible Electronics

• very thin ICs down to 5μm

• high performance

• flexibel but brittle

• higher functionality on small area

• assembly effort

• advanced electronics applications

Research project BMBF-ASSEMBLE

• Today‘ssituation:

• Smaller and smaller dies haveto be handled in huge amounts and at extremely lowcosts

• Billions of RFID tags at a price << 5 US centwould benecessaryto enablesingle itemtracking• Development task:

• Eliminate standard pick & place robotics and find new processes whichallow self-assembly and self-interconnection of extremely small chips

Discrete devices

Smart Labels

Basic principle of a self-assembly process for small dies

Surfacepatterning

Dispense chip in droplet

Self-alignment

Self-interconnection

Example: Self alignment of a thin test chip in liquid environment

Chip dispensed within a droplet of water

Principle of mobile electrostatic carrier substrates

Bipolar configuration: electrodes are chargedoppositelyElectrostatic field remainsactive after disconnectingpower supply

Device wafer

Power supply0,2 ... 2 kV

Mobile electrostaticcarrier

Electrostatic force between wafer and carrier:

F = ε U2 A / 8 d2

Bumping process performed at 50 – 70 μm thin test wafers

mobile ESC Thin wafer on mobile-ESC entering theprinting machine,

Bumping process performed at IZM in Berlin by R. Patzelt and D. Manessis

Thin wafer with NiAu UBM attachedonto mobile electrostatic carrier

mobile ESC

Solder ball bumping performed at 55 μm thin test wafersby means of mobile electrostatic carriers

Solder balls: SnAgCu, diameter ca. 140 μm

55 μm

Bumped wafer after solder reflow

Reel-to-reel (R2R) assembly of thin chip

• FC bond by use of ACA

• Up to now only partially bonded chips achieved

backside view of a partially bonded chip

Chip on Cardboard: Contact to ultra-thin ICs

Screen-printed antenna and IC contact

Printed Isoplanar Contacts on thin ICs (25μm)

Chip 1 x 1 mm2

Daisy Chain with 4 contacts

Chip 2 x 2 mm2

Chip 3 x 3 mm2

• Full flexible solution with ultra thin silicon (20μm)

• Cost-effective manufacturing

• with reel-to-reel printing and die bonding

Polytronics Using Flexible Silicon ICs

Energy-Autarkic Micro Sensor System

Basestation

Receiver for the sensor data

with RS232 Interface

Energy harvesterwith

energy store

Visualisation of thesensor data with a

868Mhz

13,56MHz

Data-transmitter

Microcontroller with

sensor

An Energy-Autarkic Micro Sensor System

mask alignment

UV exposure

spoolerdespoolerRealization of the sensor module in reel-to-reel technology and molding of the sensor

The measurement of temperature in an automotive application

• Tire parameters:• Temperature, rpm, inflation

pressure,ID, age, heat dissipation, remaining service life

• The tire parameters could be monitoredduring the operation and warn thecar driver if the driving safety is endangered

EL Displays, Lighting and Signage

Anorganic electroluminescensematerial in polymer matrixRzR Screen-print (5 layers)Substrate: PET-FolieMounted on acrylic glas panel

Smart PlasticIntegration of Peripherics with Electronics in Foils

organicDisplaysHuman Maschine InterfaceData output

AnorganicElectronics (Si)High funktionality

organicelectronicsCost-effektivLarge area

Polymer Solar CellsEnergy

Foil SensorsData inputDetectionBio-sensors

Aktuator LayerData outputsystem funktions

Ambient Intelligence

Polytronics

Micro Systems meets Life Sciences

• Bio-Chip & Diagnostische Systeme, Lab-on-chip, Micro-Opto-Fluidic MOF, Plastik-MEMS

• Implantables, Bio-Compatible, Bio-Interfaces

• Health Care Sensors, Low Power• Fluidics, Sensors, Micro Reactors

Lifetronics -Tools & Components for Biology,Medicine & Pharmaceutics

MOF-structure

Polytronics

Biosystemintegration

Electrochemical electrodes: design

CECounter

electrode

REReferenceelectrode

WEWorkingelectrode

Design considerations: Area CE >> Area WE(pseudo) RE near WE

Electrodes on glas and plastic

Printing or

discreteLamination

Lithography(or printing

or embossing)Lamination

Printing or

direct metal

Lamination

or web-coatingor print

Laser to open contacts and ports

and to separate MEMS devices

substrate

Placementof discrete

components

FC discrete

Low-Cost MEMS in R2R

substrate

HF Metal1 Inductance

LF Metal2 Inductance

HF chips1

Solarcell – Sensors - Actuators

batterie

CapacitanceResistorOpto-Waveguides

chips2Resistor Capacitance

Application: Complex Flexible System Integration and -assembly in Reel-to-Reel

Large area cost-efficient organic electronics integration

Large-area multi-functional systems

• distributed over a large area• connected in a network (sensor network), displays• Wearable integrated in clothes and textiles• Autarkic solar, energy scavenging• Bio-medical diagnostics, bandages, implantables• Low-cost systems : e.g. Disposables

• Smart Plastics

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