IZM FraunhoferInstitut Zuverlässigkeit und...

IZM

Fraunhofer Institute Reliability and Microintegration

Polytronic Systems Department - Munich

K. Bock 10. Europ. Elektroniktechn.-Kolleg, Mallorca 2007

FraunhoferIZM

Institut Zuverlässigkeit und Mikrointegration

Institutsteil München

Large area cost-efficient electronics integration.“Flexible Substrate – Polytronische Systeme“

Karlheinz BockFraunhofer Institute for Reliability and MicrointegrationHansastr. 27d, D-80686 Munich, Germany, [email protected]

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Outline

• Introduction• Plastics Electronics manufactured in Roll to roll (reel to reel)• Performance and Technology Integration• Silicon does not sleep• Micro-Systems in R2R – Smart Plastics• Outview

Artist visionSource Fraunhofer

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Moore‘s Law

Through-Hole Wave

1970 1980 1990 2000 2010

10

100

1000

Syst

em V

olum

ea.

u

Area Array Wave

Surface-Mount Wave

10000

1

2020

PackagingGap

100000

1000000

Hetero SystemIntegration Wave

HDI - Wave

Electronic Systems Packaging Technology Waves

NANO

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Polymers – basic material for future electronics & systems?

substrates and interconnects

transistors and ICs, memory

sensors and aktuators MEMS

Power - batteries and solar cells

Displays, lighting, signage

Packaging and housing

Media connections - fluidics pneumatics...

In-Line Processes Reel to Reel, or sheet

⇒ Complete systems based on most-Polymers

Polytronic Systems pictures: FhG-IAP. FhG-IPMS, FhG-IZM, Power Paper Ltd.

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Flexible Substrates & Large Area ?

• For production reasons– Substrate handling, large volume, – Material efficiency

• Add to existing production processes– Free form factor for final product– In-line integration in end product– Surface integration

• The end product is to be flexible– Reliable & Ruggedized, shatterproof– Thin & rollable, – Wearable & light weight,

Artist view Fraunhofer Journal

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Summary of Process Targets for Large Area Electronics

• Small critical dimension (lithography) channel length

• high yield, higher integration scale

• better reproducibility small variation in FET performance

• good conductive wiring (thin metals) better interconnection

• antenna integration for wireless communication of

ubiqitious systems (RFId, ambient intelligence)

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What price.... PrIntegrated Circuit

• Resolution of mass printing has to reach <10 μm (now100μm), Registration has also to improve, but not so significantly as compared to resolution

• Material properties like conductivity and mobilityhave to improve by a factor of 10-100 to be able to massprint electrically operational circuits

• Structurization accuracy (d structure / d roughness) has to improve by a factor of 100

• Thickness of mass printed dielectric can only be reducedto <1μm if first two requirements are not reached, because of electrical and geometrical limitations.

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High Density Interconnect Technology

Waferlevel HDI with integratedThin (20µm) Si Chips and 5µm Cu routing

Processed layers : µmMetal 4 Ni contact pads 10Dielectric 3 PI passivation 20Metal 3 Cu routing 5Dielectric 2 Polyimide 20Metal 2 Cu routing 5Dielectric 1 Polyimide 20Metal 1 Ni contact pads 10Separation Thermoplast 10Mech. Carrier Si-Monitorwafer 520

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Focus of IZM Development

evaporation

small molecules

solvent based

polymer

very low-cost

Sensor networks

large area

display driver

digital processed

end-user electronic

sheets

rolls

wafer

coating process application field manufacturing

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Dimensional Accuracy of Copper Patterning

dimensional accuracydepends on- mask quality- resist process- etching process

dependent on gap to nextstructure

after lithograpyafter etching

-6

-4

-2

0

2

0 25 50 75 100

distance to next pattern [μm]

devi

atio

n[μ

m]

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Development of fine pitch substrates using R2R

• Subtractive and semiadditive processes developed

• Subtractive technique: Only for thin metal layers and/or regular pattern applicableSmall single lines with large distance to next structure should be avoided

• Semiadditive technique:Dry fotoresist DuPont MX5015, thickness 15μmSubstrate: metallized polyimide tape with 1μm CuLimit of pattern resolution corresponds strongly to photoresist thickness with an aspect ratio of ca. 1 ⇒ minimal lines and spaces of ca. 15μm

40μm pitch 30μm

Semiadditive technique, Cu thickness ca. 6μm

SHIFT - IST 507745 Smart High-Integration Flex Technologies

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Second conductor layer by screen printing

screen printed lines crossing Cu lines test sheet 200x200 mm²

• Minimal lines and spaces of first Cu layer: 15μm

• Minimal lines and spaces of printed second layer: 200μm

• Also 50μm via openings show contact between both layers


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UV-Lithography

mask alignment

UV exposure

spoolerdespooler

etch unit

resist striprinse

dryerrinse

Reel-to-Reel Application Center - Equipment

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Reel-to-Reel Application Center - Equipment

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Summary: Reel-to-Reel Manufacturing of Polymer Electronics

• All Processes can be done from Roll to Roll

• UV-lithography, blading of OSC, gate isolation , screen print gate conductor, via and interconnect

• Patterning Steps are done in stop&go with 200 mm steps

polymer-FET

coppersubstratesubstrate

gate conductorprintedgate conductorprintedvia

gate dielectricbladedgate dielectricbladed

semicond. polymerbladedsemicond. polymerbladed

copperwet-etchedcopperwet-etched

via openedwith solventvia openedwith solvent

top wiringprintedtop wiringprinted

multilayerdielectricprinted

multilayerdielectricprinted

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Automatised Test Equipment

Reel-to-reel test equipped withsoftware controlled patternrecognition and measurement

Needle probe for device characterization withKeithley parameter analyzer (4 SMUs)

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• Setup for measurement

-V -V

V

22M

22M

100n

20M

Bode plot flexible OFET SD 40μm

-12

-10

-8

-6

-4

-2

0

2

4

1kHz 10kHz 100kHz 1MHz

Frequency [Hz]

Am

plit

ud

e [

dB

]

Dynamic Behavior of Polymer TFT

process & device performance data see following presentation of G.Klink

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Development of a polymer temperature sensor in Roll to Roll

-R1

R1R2

R2

Sensor circuit

+

-

Temperature threshold discrimination

20 40 60 80 10048

49

50

51

52

53

54

55

Supp

ly v

olta

ge (V

)

Temperature (°C)

output 1 output 2

Selection of a material with positive and a material with negative temperature coefficient allows realisation of the temperature sensor

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Integration of Polymer Electronics to Systems

•Antennae

etched copper printed silver

•Fused ROM for Memory

copperconductortripped bycurrent pulse

•Logic Circuits

layout for a small scale integrated

logic polymer circuit•Encapsulation

y = -0,0006x + 1,0083

92%

94%

96%

98%

100%

102%

0 20 40 60 80 100 120storage time 35°C/85%rH

Measurement of transistordegradation in humid environment

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Differential amplifier – Interface to sensors

Schematics Comparator

Layout

Circuit

Polymer System Integration needs analog-digital interface for sensors

Design, layout and processing finished, device in evaluation

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Ultra Thin Silicon

Technologies for Flexible Electronics

• very thin ICs down to 5μm

• high performance

• flexibel but brittle

• higher functionality on small area

• assembly effort

• advanced electronics applications

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Research project BMBF-ASSEMBLE

• Today‘ssituation:

• Smaller and smaller dies haveto be handled in huge amounts and at extremely lowcosts

• Billions of RFID tags at a price << 5 US centwould benecessaryto enablesingle itemtracking• Development task:

• Eliminate standard pick & place robotics and find new processes whichallow self-assembly and self-interconnection of extremely small chips

Discrete devices

Smart Labels

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Basic principle of a self-assembly process for small dies

Surfacepatterning

Dispense chip in droplet

Self-alignment

Self-interconnection

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Example: Self alignment of a thin test chip in liquid environment

Chip dispensed within a droplet of water

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Principle of mobile electrostatic carrier substrates

Bipolar configuration: electrodes are chargedoppositelyElectrostatic field remainsactive after disconnectingpower supply

Device wafer

+_

Power supply0,2 ... 2 kV

Mobile electrostaticcarrier

Electrostatic force between wafer and carrier:

F = ε U2 A / 8 d2

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Bumping process performed at 50 – 70 μm thin test wafers

mobile ESC Thin wafer on mobile-ESC entering theprinting machine,

Bumping process performed at IZM in Berlin by R. Patzelt and D. Manessis

Thin wafer with NiAu UBM attachedonto mobile electrostatic carrier

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mobile ESC

Solder ball bumping performed at 55 μm thin test wafersby means of mobile electrostatic carriers

Solder balls: SnAgCu, diameter ca. 140 μm

55 μm

Bumped wafer after solder reflow

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Reel-to-reel (R2R) assembly of thin chip

• FC bond by use of ACA

• Up to now only partially bonded chips achieved

backside view of a partially bonded chip


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Chip on Cardboard: Contact to ultra-thin ICs

Screen-printed antenna and IC contact

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Printed Isoplanar Contacts on thin ICs (25μm)

Chip 1 x 1 mm2

Daisy Chain with 4 contacts

Chip 2 x 2 mm2


Chip 3 x 3 mm2


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• Full flexible solution with ultra thin silicon (20μm)

• Cost-effective manufacturing

• with reel-to-reel printing and die bonding

Polytronics Using Flexible Silicon ICs

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Energy-Autarkic Micro Sensor System

Basestation

Receiver for the sensor data

with RS232 Interface

Energy harvesterwith

energy store

Visualisation of thesensor data with a

PC

868Mhz

13,56MHz

Data-transmitter

Microcontroller with

sensor

An Energy-Autarkic Micro Sensor System

mask alignment

UV exposure

spoolerdespoolerRealization of the sensor module in reel-to-reel technology and molding of the sensor

•

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The measurement of temperature in an automotive application

• Tire parameters:• Temperature, rpm, inflation

pressure,ID, age, heat dissipation, remaining service life

• The tire parameters could be monitoredduring the operation and warn thecar driver if the driving safety is endangered

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EL Displays, Lighting and Signage

Anorganic electroluminescensematerial in polymer matrixRzR Screen-print (5 layers)Substrate: PET-FolieMounted on acrylic glas panel

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Smart PlasticIntegration of Peripherics with Electronics in Foils

organicDisplaysHuman Maschine InterfaceData output

AnorganicElectronics (Si)High funktionality

organicelectronicsCost-effektivLarge area

Polymer Solar CellsEnergy

Foil SensorsData inputDetectionBio-sensors

Aktuator LayerData outputsystem funktions

Ambient Intelligence

Polytronics

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Micro Systems meets Life Sciences

• Bio-Chip & Diagnostische Systeme, Lab-on-chip, Micro-Opto-Fluidic MOF, Plastik-MEMS

• Implantables, Bio-Compatible, Bio-Interfaces

• Health Care Sensors, Low Power• Fluidics, Sensors, Micro Reactors

Lifetronics -Tools & Components for Biology,Medicine & Pharmaceutics

MOF-structure

Polytronics

Biosystemintegration

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Electrochemical electrodes: design

CECounter

electrode

REReferenceelectrode

WEWorkingelectrode

Design considerations: Area CE >> Area WE(pseudo) RE near WE

Electrodes on glas and plastic

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Printing or

discreteLamination

Lithography(or printing

or embossing)Lamination

Printing or

direct metal

Lamination

or web-coatingor print

Laser to open contacts and ports

and to separate MEMS devices

substrate

Placementof discrete

components

FC discrete

Low-Cost MEMS in R2R

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substrate

HF Metal1 Inductance

LF Metal2 Inductance

HF chips1

Solarcell – Sensors - Actuators

batterie

CapacitanceResistorOpto-Waveguides

chips2Resistor Capacitance

Low-K

VCSEL

RF

Application: Complex Flexible System Integration and -assembly in Reel-to-Reel

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Large area cost-efficient organic electronics integration

Large-area multi-functional systems

• distributed over a large area• connected in a network (sensor network), displays• Wearable integrated in clothes and textiles• Autarkic solar, energy scavenging• Bio-medical diagnostics, bandages, implantables• Low-cost systems : e.g. Disposables

• Smart Plastics

Date post:	19-Mar-2020
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