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Diplomarbeit Development of Fractional-N Based Frequency Synthesizers for a 5,2 GHz Radio Front-End Ausgef¨ uhrt zum Zwecke der Erlangung des akademischen Grades eines Diplom-Ingenieurs unter Leitung von Dipl.-Ing. Robert Langwieser und Ao. Univ.Prof. Arpad L. Scholtz E389 Institut f¨ ur Nachrichtentechnik und Hochfrequenztechnik eingereicht an der Technischen Universit¨at Wien Fakult¨atf¨ ur Elektrotechnik und Informationstechnik von Michael J. Glatz 9925361 Dreipappelstr. 24, 2700 Wr. Neustadt Wien, September 2007
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Page 1: Development of Fractional-N Based Frequency Synthesizers … · Diplomarbeit Development of Fractional-N Based Frequency Synthesizers for a 5,2GHz Radio Front-End Ausgefu¨hrt zum

Diplomarbeit

Development of Fractional-N BasedFrequency Synthesizers for a 5,2GHz

Radio Front-End

Ausgefuhrt zum Zwecke der Erlangung des akademischen Grades eines

Diplom-Ingenieurs unter Leitung von

Dipl.-Ing. Robert Langwieser

und

Ao. Univ.Prof. Arpad L. Scholtz

E389

Institut fur Nachrichtentechnik und Hochfrequenztechnik

eingereicht an der Technischen Universitat Wien

Fakultat fur Elektrotechnik und Informationstechnik

von

Michael J. Glatz

9925361

Dreipappelstr. 24, 2700 Wr. Neustadt

Wien, September 2007

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Abstract

In telecommunications, data transmission from transmitter to receiver utilizesspecific techniques. Some of these perform a shift of the information signal tothe preferred carrier frequencies to obtain suitable propagation conditions. Forwireless transmission, the frequency spectrum is divided to assign each servicepermitted frequency bands. Therefore, flexible carrier frequencies become a ne-cessity. Specialized oscillators, called frequency synthesizers, provide adjustableoutput frequencies. They enable transmitter and receiver systems to allocatetheir assigned transmission bands.

This work describes the development of two fractional-N based frequency syn-thesizers for different center frequencies. The concept is elaborated, and all com-ponents are described in detail. The developed synthesizer control software isexplained, and finally performance measurements of both synthesizers are pre-sented.

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Kurzfassung

In der Telekommunikation werden zur Datenubertragung zwischen Sender undEmpfanger verschiedene Techniken angewandt. Dabei wird das Informations-signal in gewissen Fallen zu Tragerfrequenzen hin verschoben, um entsprechendeAusbreitungsbedingungen zu erhalten. In der drahtlosen Kommunikation werdenverschiedenen Diensten jeweils erlaubte Frequenzbander aus dem Funkfrequenz-spektrum zugewiesen. Um diese Frequenzbander auswahlen zu konnen, werdenflexible Tragerfrequenzen benotigt.

Sender und Empfanger benotigen zur Auswahl der zugewiesenen Frequenz-bander spezielle Oszillatoren mit veranderlichen Ausgangsfrequenzen. Man sprichtvon Frequenzsynthesizern.

Diese Arbeit beschreibt die Entwicklung zweier Fractional-N Frequenzsynthe-sizer mit unterschiedlichen Mittelfrequenzen. Dabei wird auf das Konzept, dieEinzelkomponenten, die Softwaresteuerung und meßtechnische Erfassung der Re-sultate eingegangen.

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Contents

Introduction 1

1 System Concept 31.1 Local Oscillators in Radio Systems . . . . . . . . . . . . . . . . . 3

1.1.1 Frequency Conversion and Channel Spacing . . . . . . . . 31.1.2 Radio Test and Measurement System . . . . . . . . . . . . 6

1.2 Frequency Synthesizer Setup . . . . . . . . . . . . . . . . . . . . . 81.2.1 Main Circuit Board . . . . . . . . . . . . . . . . . . . . . . 81.2.2 Microcontroller . . . . . . . . . . . . . . . . . . . . . . . . 101.2.3 Voltage Supply . . . . . . . . . . . . . . . . . . . . . . . . 10

2 Phase-Locked Loop Frequency Synthesizers 112.1 Principle of Operation . . . . . . . . . . . . . . . . . . . . . . . . 11

2.1.1 Basic PLL Elements . . . . . . . . . . . . . . . . . . . . . 112.1.2 Extended System with Frequency Divider . . . . . . . . . 142.1.3 Synthesizer Realization with a PLL IC . . . . . . . . . . . 17

2.2 PLL IC Comparison . . . . . . . . . . . . . . . . . . . . . . . . . 192.3 Loop Filter Design . . . . . . . . . . . . . . . . . . . . . . . . . . 21

3 The Phase-Locked Loop Synthesizer for 1087,5 MHz 253.1 Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 263.2 Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

3.2.1 Reference Oscillator . . . . . . . . . . . . . . . . . . . . . 273.2.2 Burr-Brown BUF634 Buffer Amplifier . . . . . . . . . . . . 293.2.3 Crystek 960-1200 MHz VCO . . . . . . . . . . . . . . . . . 293.2.4 Mini Circuits MAV-11SM Amplifier . . . . . . . . . . . . . 313.2.5 Analog Devices ADF4153 PLL IC . . . . . . . . . . . . . . 323.2.6 Loop Filter . . . . . . . . . . . . . . . . . . . . . . . . . . 33

3.3 Schematics and Layout . . . . . . . . . . . . . . . . . . . . . . . . 35

4 The Phase-Locked Loop Synthesizer for 4252,5 MHz 394.1 Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 404.2 Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40

4.2.1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . 404.2.2 Crystek 4100-4300 MHz VCO . . . . . . . . . . . . . . . . 41

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4.2.3 Hittite HMC432 Prescaler . . . . . . . . . . . . . . . . . . 424.2.4 Agilent MGA-82563 Amplifier . . . . . . . . . . . . . . . . 434.2.5 Loop Filter . . . . . . . . . . . . . . . . . . . . . . . . . . 44

4.3 Schematics and Layout . . . . . . . . . . . . . . . . . . . . . . . . 45

5 Setting Output Frequencies with the TI Microcontroller 495.1 Generating PLL IC Register Data Sets . . . . . . . . . . . . . . . 495.2 3-Wire Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . 515.3 MSP430F149 Microcontroller Program . . . . . . . . . . . . . . . 53

6 Performance Measurements 576.1 Setup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 576.2 Results . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59

Summary 64

Acknowledgments 65

A Additional Documentation 67A.1 Microcontroller Program Listing . . . . . . . . . . . . . . . . . . . 67A.2 Synthesizer Part List and Placement . . . . . . . . . . . . . . . . 71A.3 Voltage Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81

Bibliography 86

List of Abbreviations and Symbols 88

List of Figures 90

List of Tables 92

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Introduction

Frequency synthesis oscillators, which in this work will be termed frequency syn-thesizers or synthesizers for simplicity, are an integral element of frequency con-version. In one or multiple steps, the baseband spectrum is shifted towards acarrier frequency. While the intermediate frequency is fixed for technological rea-sons, the output frequency is required to be flexible in many applications. In thiscase, frequency synthesizers can be used to provide adjustable frequencies for theconversion.

This diploma thesis focuses on two frequency synthesizers which serve as firstand second LO1 for a test and measurement system, with center frequencies of1087, 5 MHz and 4252, 5 MHz, respectively. Both are designed and constructedspecifically for this application.

In Chapter 1 the concept of a radio system is outlined in which the presentedsynthesizers will be used. It is emphasized which components of the radio systemare investigated in this thesis.

The theory of PLL2 synthesizers is reviewed in Chapter 2 to render the opti-mum synthesizer concept for the intended application. An according integratedcircuit, the ADF4153, that will be used for the composition of both LO1 andLO2, is presented. A comparison chart of PLL integrated circuits informs aboutthe general performance level of devices available on the market at the time ofcomponent selection. An important task, the design of the PLL loop filter, is ad-dressed. With regard to the realization of both synthesizers, the passive secondorder loop filter topology is emphasized.

The PLL principles are applied to design a synthesizer with 1087, 5 MHzcenter frequency in Chapter 3. All components are presented and discussed indetail, including the VCO3, the RF4 amplifier, the reference oscillator, and theloop filter setup. The interaction of all these components and additional circuitryare combined in the provided schematics and result in the depicted RF layout.

Similarly, in Chapter 4 a synthesizer for 4252, 5 MHz is presented, based onthe foundations emphasized in Chapter 2. Again the choice of all componentsand the RF circuitry are discussed.

1Local Oscillator2Phase-Locked Loop3Voltage Controlled Oscillator4Radio Frequency

1

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In the next step, a microcontroller approach to set the output frequency andother parameters of the PLL circuit is described in Chapter 5. Program codefor uploading data to the PLL is shown. When connected to a synthesizer PCB5

from Chapter 3 or Chapter 4, the controller makes the setup fully operational.With the completed synthesizer setup, output spectrum measurements for

both synthesizers have been performed, which is covered in Chapter 6. Varioussynthesizer settings are investigated. Thus the synthesizer function is confirmedand the performance can be classified.

Finally, the diploma thesis is summed up.

5Printed Circuit Board

2

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Chapter 1

System Concept

To begin, this chapter explains the task of frequency synthesizers in radio sys-tems. The synthesizer implementations are required to have a certain amount offlexibility, but high performance is emphasized for the use in radio systems.

For this work, the frequency synthesizers may be viewed as autonomous sub-systems, as their RF outputs represent standardized interconnections and thesynthesizers will also housed in dedicated enclosures. Thus it is possible to focuson the synthesizer subsystems alone, but with emphasis to their role in the entiresystem. Section 1.2 covers the synthesizer composition.

1.1 Local Oscillators in Radio Systems

Radio signals occupy dedicated bands of the frequency spectrum. These bandsare characterized by their upper and lower cut-off frequencies, or equally, by theirbandwidth and center frequency. Within that frequency band, a given radiosystem may transmit with a significant power spectral density. The receiveraccordingly picks this band out of the radio spectrum to process it and decodethe sent message.

1.1.1 Frequency Conversion and Channel Spacing

In their original form, telecommunication signals either have lowpass character,with vanishing spectrums at points greater than a cut-off frequency1, or pass-band character with bias to near-DC2 values. However, to allocate the assignedfrequency band for obtaining suitable transmission conditions, both transmitterand receiver of the radio system have to perform a frequency conversion. Thisprocess can be realized by a component called mixer. An ideal mixer can bemodeled as a multiplier as seen in Figure 1.1.

1With respect to real-valued signals, the absolute frequency value is considered.2Direct Current, i.e. zero frequency

3

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1.1 Local Oscillators in Radio Systems

1f

2f

21 ff

21 ff

Figure 1.1: Ideal Mixer.

Let us assume two sinusoidal input signals for the multiplier with frequenciesf1 > 0 and f2 > 0, respectively. It can be shown that the output frequencies thenare f1 + f2 and |f1 − f2|, without the presence of either f1 nor f2. This propertydescribes the wanted frequency conversion.

Now one sinusoidal input signal of the mixer is replaced by the messagesignal in passband domain with center frequency f1. When ideally multiply-ing this passband signal with a second signal containing only a single frequencycomponent fLO, the multiplication will yield another passband signal, which is afrequency-shifted version of the message signal by amount of fLO. Thus f1 + fLO

becomes the carrier frequency. The multiplier has performed an upconversion(cf. Figure 1.2), and the signal is now ready for transmission. The task of gener-ating fLO is done by the local oscillator.

LO

Power Spectral Density

f

1f LOff1LOf

Figure 1.2: Signal Spectra for Upconversion.

The same principle is applied for the downconversion process (Figure 1.3),i.e. the frequency shift from RF to baseband at the receiver. After passbandfiltering of the wanted signal for image rejection and blocking prevention, thereceived passband signal is fed into a mixer. The receiver’s local oscillator is tunedto fLO. According to the principle described above, the resultant spectra aresituated at the sum and difference frequencies of the mixer inputs. As depicted,we obtain spectra in the original passband location at f2 − fLO and a versionshifted to f2 + fLO, which can be omitted by filters.

The conversion process may be done in one or multiple steps. The quality ofavailable electronic filters and active components has physical limits, that is why

4

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1.1 Local Oscillators in Radio Systems

LO

Power Spectral Density

f

LOff2 2fLOf LOf2 LOff2

Figure 1.3: Signal Spectra for Downconversion.

in some cases it is wiser to perform the frequency conversion in multiple steps.For heterodyne3 frequency conversion, the way from baseband to carrier frequencyand back leads over at least one intermediate frequency IF. Every conversion stepis achieved by components specialized for their working frequency range. Forexample, the local oscillators in a two-step heterodyne system are termed LO1and LO2.

Many radio systems split up a relatively broad transmission band into severalchannels, which occupy adjacent frequency bands. Usually the channels have

f

......

CfCfPower Spectral Density

Figure 1.4: Channel Raster.

equidistant center frequencies and are of identical bandwith. The distance be-tween two adjacent channel center frequencies ∆fC is the required fundamentalinterval for channel selection. See Figure 1.4 for illustration.

If the LO frequency is adjustable, it can either be set to arbitrary or only tospecific values within the supported frequency range. For example, the possibleLO output frequencies are equidistant in steps of fstep. In this case, the condition

∆fC = n · fstep with n ∈ N (1.1)

must be satisfied for successful channel selection.

3as opposed to the homodyne principle which only performs one conversion step

5

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1.1 Local Oscillators in Radio Systems

1.1.2 Radio Test and Measurement System

This diploma thesis is intended to supply the local oscillator technology for aRapid Prototyping radio transmitter and receiver system. To meet the specificdemands of this project, two different oscillators, which will be realized as fre-quency synthesizers, are required.

LO1 LO2

LO1 LO2

BPF BPF BPF

BPFBPFBPF

Power AmpMixer

MixerMixer

Mixer

LNAAmplifier

1087,5 MHz 4252,5 MHz

1087,5 MHz 4252,5 MHz

Rx Antenna

Tx Antenna

5,2 GHz

Radio Link

TRANSMITTER

Signal

Processing

Signal

Processing

RECEIVER

140 MHz

140 MHz

Figure 1.5: Proposed Transmitter and Receiver (1 Channel).

The system consists of transmitter and receiver, each with heterodyne fre-quency conversion utilizing two local oscillators, with center frequency 1087,5 MHzfor LO1 and 4252,5 MHz for LO2. The basic radio system in Figure 1.5 uses oneantenna at the transmitter and also one antenna at the receiver. The proposedsystem in contrast uses eight transmitters and eight receivers, each with dedicatedantennas (Figure 1.6). The eight transmission antennas can be driven indepen-dently. With this setup, the system performance can be significantly enhanced,and similar improvement is possible on the receiver side. The overall setup repre-sents an 8×8 - MIMO4 system with a total antenna count of 16. Importantly, alleight parallel transmitter frontends use the same LO frequencies, i.e. the overalltransmitter still requires only LO1 and LO2 synthesizers, albeit each now witheight uniform outputs. The same holds true for the receiver. To recapitulate,the proposed 8 × 8 - MIMO system in total requires two local oscillators with

4Multiple Input Multiple Output

6

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1.1 Local Oscillators in Radio Systems

1087,5 MHz center frequency and also two with 4252,5 MHz. These synthesizersare object of this diploma thesis.

Signal

Processor

LO2LO1Sync

D

A

1087,5 MHz 4252,5 MHz

Signal

Processor

LO2LO1Sync

A

D

Receiver

Radio-Front-End

1087,5 MHz 4252,5 MHz

5,2 GHz

Radio Link

8-Antenna-Array

Transmitter

Radio-Front-End

8-Antenna-Array

Figure 1.6: System for 8 × 8 - MIMO.

Chapter 3 addresses LO1 with f0 = 1087, 5 MHz and Section 3.1 deals withits exact requirements. For LO2 generating f0 = 4252, 5 MHz, Chapter 4 explainsthe specific requirements in Section 4.1.

The most important requirement for both synthesizers is to feature low noiseRF output spectrums combined with a small frequency step size, without disre-garding the other demands.

7

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1.2 Frequency Synthesizer Setup

1.2 Frequency Synthesizer Setup

This section shows the components of the synthesizer and their interaction. Thesecomponents are

- the main circuit board,

- the microcontroller, and

- the voltage supply.

The setup is depicted in Figure 1.7, where the main circuit board featuresconnectors for the RF output as well as the frequency reference signal inputand output. By using the microcontroller, the synthesizer RF output frequencyand other parameters can be programmed. A voltage supply provides multipleoutputs for the main circuit board and the microcontroller.

SMB

Main Circuit Board

Voltage Supply

PCB

Micro-

Controller3-Wire Interface

+3,0 V

+4,4 V

+5,0 V

+12,0 V

-12,0 V

DC

PC

RF OUT

REF IN

REF OUT

SMB

SMBD

C +12,0 V

Interface

Converter

JTA

G

+3,0 V

Figure 1.7: Frequency Synthesizer Components.

Below, the individual components are described in more detail.

1.2.1 Main Circuit Board

The PLL circuit is placed on the main circuit board (PCB). There is one PCB forthe 1087,5 MHz synthesizer and another PCB for the synthesizer that covers thegeneration of 4252,5 MHz. The circuit has subareas with different frequencies ofoperation, from 10 MHz at the reference oscillator to radio frequency (>1 GHzand >4,2 GHz respectively). The circuit elements found on either PCB include

8

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1.2 Frequency Synthesizer Setup

- the 10 MHz reference oscillator,

- the PLL IC,

- the loop filter,

- the VCO,

- the RF prescaler5 and

- the RF output amplifier.

Figure 1.8 shows a block diagram that depicts the interaction of these compo-nents. By means of a selector, either the input from REF IN or the signal from

Loop

Filter

Reference

Oscillator

Selector

RF Output

Amplifier

Impedance

Buffer

RF

Prescaler

RF OUT

REF OUT

REF IN

DC Supply Voltage

Programming Interface

Main Circuit Board

RF Microstrip Line

PLL

IC

VCO

Figure 1.8: Block Diagram of the Main PCB.

the onboard reference oscillator is passed on to an impedance buffer. The outputof this buffer amplifier is present at the REF OUT output and the reference inputof the PLL IC. In combination with the loop filter, the PLL IC output generatesa control voltage at the VCO input. As reaction to this voltage, the VCO gener-ates an RF signal, and the output amplifier provides isolation between the PCB’sRF output and the VCO. A part of the VCO output power is directed back viathe RF prescaler to the PLL IC for frequency and phase comparison with thereference signal.

The programming interface receives data from the microcontroller for loadingthe PLL IC register set, while a DC voltage supply powers the circuits across thePCB.

5on the 4252,5 MHz PCB only

9

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1.2 Frequency Synthesizer Setup

1.2.2 Microcontroller

The microcontroller or µC is situated on a dedicated PCB, and is connectedto the main circuit board via standard 3-wire-interface. The Texas Instruments

low-consumption controller MSP430F149 in a demo board setup is used to sendcontrol data to the PLL PCB. On the other hand, the µC can be linked to apersonal computer by means of a JTAG6 interface. Thus, it is possible to uploadnew program code and frequency data to the controller flash memory.

1.2.3 Voltage Supply

The voltage supply PCB provides five output voltages for the various componentson the main circuit board. Three linear voltage regulators provide DC outputsof 3,0 V, 4,4 V and 5,0 V. The +12 V rail is directly passed on to the mainPCB. In addition, one -12V DC output from a DC-DC converter is available.The PCB is designed to be used in conjunction with an 12 V DC supply thatfeatures adequate voltage ripple suppression and, if applicable, AC line filtering.Figure 1.9 shows a picture of the voltage supply PCB.

Figure 1.9: Picture of the Voltage Supply PCB.

6Joint Test Action Group, usual name for the IEEE 1149.1 standard PCB test access ports

10

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Chapter 2

Phase-Locked Loop FrequencySynthesizers

PLL synthesizers are well suited to be used as local oscillators in radio systems.Frequency stability and channel spacing requirements can be realized adequately.

The following sections provide both general and more specific views on PLLsynthesizers, starting with basic operation principles. From Section 2.2, there ismore focus on the specific demands of this diploma thesis.

2.1 Principle of Operation

The PLL output gets phase-locked to a reference frequency, which is arranged bycomparing reference phase and actual output phase within a loop structure. Thephase-locked state, the locked-in state, is maintained through permanent com-parison. Deviations of the output compared to the reference are compensated bythe PLL, for example frequency drifts caused by fluctuations in part temperature.

2.1.1 Basic PLL Elements

Figure 2.1 depicts a PLL containing the basic elements: phase detector, loopfilter, VCO and reference oscillator.

)(sZ

Reference Oscillator Loop Filter VCOPhase Detector

dt

df out

out

outKi

reff

ref

out

Figure 2.1: Basic PLL Elements.

11

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2.1 Principle of Operation

The PLL aims for zero phase difference between the reference and the VCOoutput. To illustrate the principle of operation, assume a VCO output signal thatlags behind the reference by a phase amount of ∆θ > 0. This phase gap could beclosed if the VCO output frequency would be slightly raised, thereby reducing ∆θuntil ∆θ = 0. At this point the initial frequency rise should be undone, to finallyhave equal frequencies and zero phase difference at the phase detector inputs. Asimilar process could be invoked to cancel out ∆θ < 0 by temporarily loweringthe VCO frequency compared to the unaltered reference.

The state of∆θ(t) = 0 ∀t > t0

from a time point t0 is called locked-in because the frequency output is nowcoupled phase-locked to the reference oscillator. Note that only signals withequal frequency can have vanishing phase difference at all time points.

Phase Detector and Charge Pump

The phase detector is the element that compares the electric phases of the ref-erence voltage generated by the reference oscillator and the actual VCO output.Based on the phase difference, the phase detector creates a voltage or currentoutput that is led to the loop filter.

A prerequisite for phase comparison is exact or near equality of the inputfrequencies. If the input frequencies are too far apart, proper function is notpossible. For this reason a combined phase and frequency detector is preferred:It acts as a frequency detector for larger frequency deviations, thus seeking avanishing frequency difference. Then the phase detector mechanism is able to takeover and finally establish lock-in. This combined frequency and phase equalityapproach can be implemented as PFD1. The reference fref may be frequency-scaled prior to the PFD. However, the resulting actual frequency fPFD at thePFD input is proportional to fref .

Modern phase detectors mostly provide controlled bipolar current sources2 asan output, where ”bipolar” means that output currents can be sourced or sinked,depending on the direction of the intended frequency change. These currentsources are often referred to as charge pumps.

Loop Filter

Coming from the phase detector, the control pulses as a result of the phasecomparison can be short in time and therefore wide in bandwidth. The followingVCO essentially requires the DC and low frequency information contained in the

1Phase Frequency Detector2Traditional theory of phase detectors involves output voltage sources, which can be viewed

as duality to current sources in the sense of the Thevenin-Norton theorems. Current sourcesexhibit some advantages over voltage sources in this application and are therefore widely usedin the industry nowadays.

12

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2.1 Principle of Operation

pulses at the control input. The DC component created by the pulses establishesequilibrium. Therefore only loop filters with low-pass behavior are considered.

Active loop filters rely on active circuits to achieve the filter transfer function3

Z(s), such as operational amplifiers in appropriate setups. These filters have thepossibility of supplying higher voltages to the VCO than the phase detector candeliver. This becomes important when VCOs requiring up to 20 V or more controlvoltage should be used. The disadvantages of the active loop filter are enhancednoise and more complexity, however.

Passive loop filters exclusively consist of passive components like resistorsand capacitors. While matching phase detector output and VCO control voltageranges are a prerequisite, this approach is preferred, because noise suppression isemphasized to maximize performance.

The number of poles in the transfer function Z(s) determines the loop filterorder. By its transfer function, the loop filter affects the open loop gain4 G(s) andtherefore has an impact on the PLL operation. The loop filter components de-termine lock time, phase margin, spur suppression and noise suppression. Theseparameters are not independent, and the designer can optimize those which aremost important in the given application. For example, while focusing on noisesuppression like in this diploma thesis, the phase margin must be monitored topreserve the PLL stability. Noise sources in a PLL are the reference oscillator,phase detector, loop filter and the VCO. If present, also frequency dividers con-tribute to the PLL noise. On the other hand, there are no lock time requirementsfor this thesis. In Section 2.3 a way to derive the component values of a passivesecond order loop filter is described in detail.

For phase detectors with charge pump output, the loop filter moreover hasthe task of converting the electric current from the charge pump into a voltageto control the VCO.

Voltage Controlled Oscillator

The VCO is the device that generates the RF output. The oscillation frequencyis variable and is determined by the VCO input control voltage. A control voltagerange is thereby translated into an output frequency range. This mapping is notnecessarily linear, but monotonic in nature. In the PLL, this device receives itscontrol voltage from the loop filter and generates an RF output accordingly. Aportion of the output power is fed back to the phase detector.

There are differences in the relative output frequency range5 and in the re-quired magnitude of the control voltage. VCOs with wider output frequencyrange are more tightly coupled to the control voltage and exhibit less inherentfrequency stability. For maximum performance, the VCO should be chosen withthe smallest output frequency range that meets the requirements. This property

3The argument s is the complex Laplace frequency variable4cf. Equation (2.16) in Section 2.35The output frequency range width is viewed in relation to the center frequency.

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2.1 Principle of Operation

is also reflected in the data sheets, where otherwise similar VCO devices showdegraded performance for wider output frequency ranges.

When a passive loop filter is used, the control input voltage is effectively gen-erated by the phase detector output. To use the full frequency range of the VCO,the phase detector must be able to produce enough voltage at its output. Theideal VCO control input is a high impedance voltage input. Actual devices havea parasitic input capacitance that sometimes cannot be neglected, for examplewhen higher order passive loop filters are used.

Last but not least the output spectrum in the simple case of a DC controlvoltage is considered. Most emphasis is directed to the VCO noise. The secondand third harmonic of the output signal have considerable power, but filters canbe applied with relative ease to suppress the harmonics.

The properties and considerations stated above considerably reduce the num-ber of suitable VCOs for the application.

Reference Oscillator

The reference oscillator is the foundation for frequency synthesis and the deter-mining reference fref . Frequency drifts or inaccuracies of this element will betranslated to the output inevitably. The reference frequency fref is in most casesfixed or only slightly altered to perform frequency fine tuning. Typically, ultra-stable oscillators provide very little tuning range in favor of frequency stability.

Crystal-based oscillators can deliver tight frequency tolerances, depending onthe crystal plane cut and the mechanical surroundings. High performance refer-ence oscillators are designed to minimize the impact of the ambient temperatureon the fundamental frequency. Their massive metal package, which includes thecrystal and electronics, is kept at constant temperature by means of controlledoven heating, thus the acronym OCXO6.

2.1.2 Extended System with Frequency Divider

Using a frequency divider in the loop between the VCO’s RF output and the PFDinput, it is possible to synthesize much higher frequencies at the PLL output thanthe reference frequency.

The frequency divider translates the RF output frequency fout to the phasedetector input fPFD by a factor of 1

N. Conversely, the output frequency is N

times the phase detector input frequency:

fout = fPFD · N (2.1)

This is fundamental, because N can be used to modify the output frequency. Thisphase-locked loop synthesis is an indirect frequency synthesis7, where different

6Oven Controlled X-tal (Crystal) Oscillator7in contrast, direct frequency synthesis uses digital signal processing

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2.1 Principle of Operation

)(sZ

N

Reference Oscillator Loop Filter VCO

Frequency Divider

Phase Detector

dt

df out

out

outKi

reff Nout /

ref

Figure 2.2: PLL Frequency Synthesizer Elements.

output frequencies can be derived from a single reference frequency with thesame relative frequency stability.

The benefits of extending the basic PLL with a frequency divider as shown inFigure 2.2 are the abilities to

- phase-lock unequal reference and output frequencies,

- enable adjustable output frequencies for a fixed reference, if the divisionfactor is programmable.

Both reasons apply for the synthesizer in this diploma thesis: To have a fixed10 MHz reference and a programmable output in the range from 1037,5 MHz to1137,5 MHz at the same time (example for the 1087,5 MHz synthesizer).

Together, the division factor N and the PFD input frequency fPFD determinethe output frequency. Whether N is an integer alone or has an additional frac-tional part has an effect on the possible outputs fout and other attributes of thePLL.

Integer-N Division

When the divider factor N can assume exclusively integer values, the step betweentwo adjacent output frequencies is because of (2.1)

fstep,int = fPFD (2.2)

This characteristic frequency step, the step size, in the case of the integer-N PLL,cannot be made small while maintaining a reasonable high comparison frequencyfPFD. To achieve best spectral purity of the output, fPFD must be as high aspossible within the specifications of the phase detector. But with higher fPFD,the step size grows accordingly. When both high performance (and thus a highcomparison frequency) and small step size are called for, a different approachrather than integer-N division should be considered.

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2.1 Principle of Operation

For fixed-frequency synthesizers, the integer-N solution may yield fine results,however. The only drawback then would be a relatively coarse spacing of thepossible output frequencies, as outputs can occur only at integer multiples offPFD.

Fractional-N Division

The synthesizers in this diploma thesis aim for maximum spectral purity of theoutput while providing a significantly smaller step size than the comparison fre-quency. Moreover, with the suggested 10 MHz reference oscillator, the requiredcenter frequencies of 1087,5 MHz and 4252,5 MHz could not be established withan integer division factor N , since both 1087,5

10and 4252,5

10are not integers.8

These circumstances demand a solution, which comes in the form of fractional-Ndivision. This concept realizes a division factor of the form

Ntot = N +K

F(2.3)

Hence, the new average division factor consists of an integer part N and afractional part K

F. K and F by themselves are integers with K > 0 and F > 0,

where K is referred to as the fraction and F as the modulus. Substituting Ntot

for N , Equation (2.1) becomes

fout = fPFD · Ntot (2.4)

Since the smallest increment for Ntot with these preconditions is 1

F, the step size

of the fractional-N PLL becomes

fstep,frac =fPFD

F(2.5)

The improvement over the integer-N division in this aspect is essential. Evi-dently the number of possible center frequencies is multiplied by the factor F incomparison to standard integer-N division.

The convenience of the fractional-N PLL has a price, which has its foundationin a new mode of operation: The average division factor Ntot is realized by alter-nating between integer factors in a time pattern that depends on the fractionalparameters K and F . A sophisticated method for this purpose uses a fractionalinterpolator to process these variables and generate an output to be used togetherwith the integer factor N . Even though this effort is often made, some configu-rations of the parameters K and F cause degraded performance with respect tothe output spectrum. The reason is that the fractional-N operation introducestemporary deviations from equilibrium, which eventually manifest themselves in

8The only solution for exactly realizing the center frequencies would be to slightly ”pull”the reference oscillator frequency (i.e. fref 6= 10 MHz), but this approach would not addressthe problem of the large step size.

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2.1 Principle of Operation

unwanted spurious lines in the output spectrum. Therefore, the quality of theoutput spectrum in this case may depend on the center frequency.

The key advantage of the fractional-N approach is the benefit of utilizing highcomparison frequencies fPFD for best noise performance while not disregardingthe step size requirements.

2.1.3 Synthesizer Realization with a PLL IC

When building a PLL synthesizer, using a PLL IC may be considered. Thefollowing sections address possible consequences and potential benefits of usingthis device.

PLL IC

The PLL IC contains a crucial PLL element, the phase detector. Often thedector output is implemented as a ”charge pump” current source. The secondcomponent within the PLL IC is the programmable frequency divider that realizesN for integer-N or Ntot for fractional-N PLLs, respectively. To improve the lock-inprocess, some PLL ICs utilize a PFD instead of the basic phase detector.

The frequency divider is implemented using counters, where the programmablecounter variables determine the divison factor. Note that these circuits in CMOS9

technology only process timing information about the zero-crossings of the inputsignal, as this is sufficient to determine the frequency. In this way the inputbecomes a CMOS square wave clock signal to trigger digital counters, and theresult is a CMOS signal with fundamental frequency fPFD at one PFD input.For minimized timing jitter of the zero-crossings and thus better performance,the PFD reference input is preferably driven by a square wave signal source likethe reference oscillator used in this diploma thesis. Furthermore, the duty cycleof the square wave has an effect on the performance. A variation from the ideal50:50 duty cycle may cause degraded performance.

If required, the comparison input frequency can be scaled down prior to thePLL IC to extend the output frequency range. For this task, an external prescalerwith fixed integer division factor is preeminent. Secondly, many PLL ICs havefeatures for doubling or dividing the incoming reference oscillator frequency. Thefollowing sections investigate the impact of the frequency extension measures onthe formulas for the fractional-N PLL.

External Prescaler

Being a device with a fixed divison factor V , the prescaler is introduced into thephase-locked loop to increase the overall division factor between RF output and

9Complementary Metal-Oxide-Semiconductor

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2.1 Principle of Operation

)(sZ

totN

Reference Oscillator

Loop Filter VCO

Frequency Divider

Phase Detector

R

DVNff totrefout

reff

PFDf

V

R

D

Frequency Scaler

Prescaler

outf

PLL IC

Figure 2.3: PLL Synthesizer with Prescaler.

phase detector.

fout = fPFD · Ntot · V = fPFD ·

(

N +K

F

)

· V (2.6)

A practical reason for using the prescaler is to lower the frequency at the RF inputof the divider Ntot. This allows to match the PLL IC, that has Ntot implemented,to VCOs of higher frequencies than the PLL IC originally would allow. In otherwords, the RF output is prescaled to match the PLL IC’s specifications. Withthis possibility, the prescaler is a very valuable tool. A side effect is the alteredstep size when using a prescaler V :

fstep,frac =fPFD

F· V (2.7)

This is easily understood as the smallest increment of the the overall divisionfactor is now V

F. Applying a prescaler factor V = 2 merely doubles the frequency

step size, which is no significant penalty for most applications.

Reference Frequency Doubling and Division

The following formula links the reference oscillator frequency fref and the phasedetector comparison frequency fPFD, where D is the frequency multiplicationfactor and R is the respective division factor.

fPFD = fref ·D

R(2.8)

This functionality may be available on the PLL IC to scale the incomingfrequency fref . An application would be to provide the phase detector with the

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2.2 PLL IC Comparison

doubled reference frequency by setting D = 2 and R = 1 (neutral), thereforeimproving the PLL noise performance. The final results for a fractional-N PLLsynthesizer with prescaler V , reference frequency multiplier D, and divider R aresummarized below.

fout = fref ·

(

N +K

F

)

·DV

R(2.9)

fstep =fref

F·DV

R(2.10)

Typically, to evoke a frequency change, only N and K are modified while theother parameters of (2.9) and (2.10) remain constant. This guarantees a constantstep size fstep across the entire output frequency range.

2.2 PLL IC Comparison

This section shows the position of the ADF4153 Fractional-N Frequency Synthe-sizer by Analog Devices [4], that will be used throughout this diploma thesis, inrelation to market contenders.

A lot of performance potential resides in the PLL IC. To get the best results,a comprehensive product comparison will prove beneficial. Of course, first thepresupposed requirement of the RF bandwidth has to be satisfied. The remainingspecifications are the foundation to pick the best IC for the application.

ADF4153 ADF4252 LMX2470 LMX2471RF bandwith [GHz] 0,5÷ 4,0 0,25÷ 3,0 0,5÷ 2,6 0,5÷ 3,6fPFD,max [MHz] 32 30 30 50Norm. phase noise [dBc/Hz] −217 −213 −200 −200Spurs @100 kHz [dBc/Hz] −60 −50 n/a n/aModulus range 12-bit 12-bit 12-bit, 22-bit 12-bit, 22-bitCharge pump levels 16 4 16 16

Table 2.1: Fractional-N PLL IC Comparison.

Table 2.1 shows some possible choices for the synthesizer’s PLL IC. All modelsfeature a Σ-∆ fractional interpolator. The ADF models come from Analog Devices,the LMX contenders from National Semiconductor.

RF Bandwidth: The maximum RF operating frequency is particularly impor-tant. All shown models require an external frequency prescaler for the4252,5 MHz synthesizer, as long as no frequency doubler at the final RFoutput is used. Rather, the VCO output is frequency divided (for examplea division by 2) to suit the PLL IC’s input capability.

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2.2 PLL IC Comparison

Maximum Comparison Frequency: In order to improve phase noise perfor-mance, higher values of fPFD are better. The LMX2471 from National

Semiconductor stands out in this category. On the other hand, given thefref = 10 MHz reference oscillator, some device has to apply frequencyscaling to establish higher fPFD. The ADF4153 has a built-in referencefrequency doubler.

Normalized Phase Noise: The actual phase noise depends on the overall divi-sion factor N and the comparison frequency fPFD. PLL IC manufacturerstherefore state a normalized phase noise figure which does not depend onN nor fPFD. With the relation

Phase Noise = Normalized Phase Noise + 20 log10 (N) + 10 log10 (fPFD)

the actual phase noise power spectral density can be obtained. When viewedtogether with Equation (2.1), the above relation instantly reflects the im-proved phase noise performance (i.e. lower phase noise) for the same outputfrequency but higher comparison frequency, as the decreased division factorN has more impact than the increased comparison frequency fPFD.

The ADF4153 has the lowest phase noise, which is the most importantfigure in this overview.

Spurious Lines (Spurs): These unintended spectral lines degrade the outputsignal in dependence on the frequency difference from the center frequency(for example 100 kHz). They should be as low as possible, and the mostpromising PLL IC in this context is the ADF4153.

Modulus Range: Recalling (2.3), the modulus F should be high to providesmall frequency steps. The modulus is key to achieve a step size in therange of 1 kHz while employing a 10 MHz reference oscillator, regardlessof the division factor R before the phase-frequency detector. All shownPLL IC models feature at least a 12-bit modulus, which is adequate. TheNational models moreover allow for a 22-bit modulus.

Number of Charge Pump Current Levels: Different current plateaus at thephase-frequency detector’s output are an advantage, since the loop param-eters for a specific output can be altered without changing the hardware,most of all the loop filter. When aiming for best phase noise performance,small charge pump currents are preferred, since the effect is similar to fur-ther increased capacitor values (which are already large) in the loop filter.With the exception of the ADF4252, all models compared here have 16programmable charge pump current levels.

The presented parameters are an assortment to discuss some important issues forthe practice. For thorough part descriptions, please refer to the data sheets [4],[7], [8] and [9].

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2.3 Loop Filter Design

After careful consideration I have chosen the ADF4153 PLL IC for both syn-thesizers described in this diploma thesis.

Specifications

This section emphasizes important specifications of the ADF4153 PLL IC tosummarize in more detail than Table 2.1. All data is provided by [4].

Parameter Conditions, CommentsRF input frequency 0, 5 ÷ 4, 0 GHz −8 dBm min / 0 dBm maxfref input frequency 10 ÷ 250 MHz slew rate > 25V/µsfref input sensitivity 0, 7 ÷ AUDD V peak-peak; AUDD: supplyfPFD,max 32 MHzCharge pump current

High plateau 5 mA typLow plateau 312, 5 µA typ

Power suppliesAUDD 2, 7 ÷ 3, 3 VUP AUDD ÷ 5, 5 VIDD 24 mA max

Table 2.2: ADF4153 Fractional-N PLL IC Specifications.

2.3 Loop Filter Design

The loop filter impedance Z(s) for the passive second order loop filter shown inFigure 2.4 is given by:

Z(s) =

(

R2 + 1

sC2

)

1

sC1

R2 + 1

sC1

+ 1

sC2

=1 + sR2C2

s2R2C1C2 + s (C1 + C2)(2.11)

With the definitions

T1 , R2 ·C1C2

C1 + C2

(2.12)

T2 , R2C2 (2.13)

Ctot , C1 + C2 (2.14)

expression (2.11) can be written as

Z(s) =1 + sT2

sCtot (1 + sT1)(2.15)

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2.3 Loop Filter Design

1C

To VCOFrom Charge Pump

2C

2R

)(sZ

Figure 2.4: Topology of the Passive Second Order Loop Filter.

)(sZ

H

Loop Filter VCO

Frequency Divider

Phase Detector

K sKVCO

/

reffoutf

Figure 2.5: The Phase-Locked Loop System.

From Figure 2.5 we gather the open loop gain G(s):

G(s) =Kφ · KV CO

s· Z(s) (2.16)

In the formula above, KV CO is the tuning sensitivity of the VCO, which givesthe frequency change of the VCO output caused by a specific tuning voltagechange. Kφ characterizes the phase detector and involves the charge pump cur-rent. The system function for the VCO is KV CO

s, as it serves as integrator with

respect to the output phase. All in-band noise sources of the PLL configuration,such as the phase detector noise, the R divider noise, the N divider noise and thereference oscillator noise have the common factor

G(s)

1 + G(s)H

in their respective transfer functions, where we identify H ≡ 1

N. Note that H

does not depend on s. Two important parameters of the phase-locked loop, the

22

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2.3 Loop Filter Design

loop bandwidth ωc and the phase margin φ, can now be defined.

|G(jωc) · H| , 1 (2.17)

π − arg G(jωc) · H , φ (2.18)

This yieldsφ = π + arctan (ωcT2) − arctan (ωcT1) . (2.19)

In order to maximize the phase margin at the loop bandwidth angular frequencywe use the approach

ω=ωc

!= 0 (2.20)

The immediate outcome is

ωcT2 =1

ωcT1

(2.21)

and thus T2 can be expressed by T1 and ωc. Substituting 1

ωcT1

for ωcT2 in Equation

(2.19) produces10

φ − π = arctan

[

1

2

(

1

ωcT1

− ωcT1

)]

or, equally,

tanφ =1

2

(

1

ωcT1

− ωcT1

)

. (2.22)

Now T1 can be explicitly expressed by solving (2.22). This allows to subsequentlyderive T2 and further Ctot. The time constants T1 and T2 depend on the phasemargin φ and the loop bandwidth ωc only, while the sum capacitance Ctot alsodepends on the phase detector, the VCO and the frequency divider.

T1 =1

ωc

[

1

cos φ− tan φ

]

(2.23)

T2 =1

ωc2T1

(2.24)

Ctot =Kφ · KV CO

N · ωc2

·

[

1 + ωc2T2

2

1 + ωc2T1

2

]1/2

(2.25)

Recalling the definitions (2.12)–(2.14), this set of expressions finally leads tothe loop filter part values as used on the PCB:

C1 = Ctot ·T1

T2

(2.26)

10arctanx + arctan y = arctan(

x+y

1−xy

)

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2.3 Loop Filter Design

C2 = Ctot − C1 (2.27)

R2 =T2

C2

(2.28)

The part values C1, C2 and R2 of the passive second order loop filter can thusbe derived in close form.

Choosing Phase Margin and Loop Bandwidth

In the calculation above, the phase margin φ and the loop bandwidth ωc mustbe chosen. The phase margin φ relates to the transient response of the PLL ata frequency change. Sufficient phase margin is required for closed loop stability.The higher φ, the better transient ringing is dampened. Typical phase marginsdesign targets range from φ = 40 ÷ 50.

Choosing the loop bandwidth ωc is finding an optimum between two goals:

1. Minimizing RMS11 phase errors and the

2. suppression of spurious lines.

To minimize RMS phase errors, ωc is chosen so that the PLL noise equals theVCO noise. On the other hand, improved rejection of spurs and noise requiresnarrow loop bandwidth.

For the given requirements using a second order passive loop filter, one shouldopt for designing the loop filter to achieve narrow ωc, thus emphasizing the secondgoal. Observing the formulas above, this approach means

- small Kφ (through small charge pump current setting) and

- large capacitor values in the loop filter.

Available capacitors naturally limit the maximum aspired capacitance values.High quality film types take up much more physical space than their low perfor-mance counterparts. Regrettably, the most desirable components for this appli-cation also take up the most physical space, are very expensive and often are notavailable in SMD12 packages.

11Root Mean Square12Surface Mounted Device

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Chapter 3

The Phase-Locked LoopSynthesizer for 1087,5 MHz

In this chapter the first local oscillator (LO1) will be depicted from a descriptionof each chosen component to the part arrangement in both circuitry and on thePCB. Figure 3.1 shows a picture of the LO1 synthesizer PCB.

Figure 3.1: Picture of the LO1 1087,5 MHz Synthesizer PCB.

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3.1 Requirements

3.1 Requirements

For the test and measurement equipment, requirements have been stated for thefirst local oscillator, summarized in Table 3.1.

Output center frequency 1087, 5 MHzOutput frequency range 1037, 5 MHz ÷ 1137, 5 MHzPhase noise power spectral density < −70 dBc/Hz for |∆f | = 10 kHz

< −85 dBc/Hz for |∆f | = 25 kHzSpurious lines < −50 dBc for |∆f | < 50 kHzFrequency step size < 10 kHzCircuit board material FR4 1,6 mmReference frequency 10 MHzReference feed internal or externalFrequency control µC typeMain supply voltage 12 V DCPhysical dimensions

Length 160 mm max.Width 80 mm max.Height 14 mm max.

Table 3.1: LO1 Requirements.

To meet the demands concerning phase noise and spurious lines of the outputspectrum, a high performance synthesizer is required. This is of particular im-portance in the context of frequency conversion with mixers. A frequency controlusing the MSP430F149 microcontroller is covered in Chapter 5. Because manyincorporated RF components are powered by voltages other than 12V DC, a sep-arate voltage regulator PCB with four additional voltage outputs is presented inSection A.3. For the choice of the OCXO, the height limit of only 14 mm was anadditional challenge. Furthermore, SMB connectors are used to save space.

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3.2 Components

3.2 Components

The phase-locked loop assembly consists of several components arranged on onePCB as shown in Figure 3.2.

Mercury

OC14T5A

OCXO

Crystek

CVCO55BE

0960-1200

RF OUT

REF IN

REF OUT

Mini Circuits

MAV-11SM

Jumper

Analog Devices

ADF4153BRU

Burr-Brown

BUF634

Power Divider

Loop Filter

Figure 3.2: PCB Overview of the 1087,5 MHz Synthesizer.

In the following, the depicted components will be addressed.

3.2.1 Reference Oscillator

As 10 MHz reference oscillator I have chosen a crystal oscillator with an oven con-trol to stabilize the unit’s temperature. All high performance oscillators profitfrom stabilized working conditions like the oven control, as the output frequencydrifts with the crystal temperature in most other circumstances. Oven controlcombined with a massive metal package makes the oscillator unit almost unaf-fected from environmental temperature fluctuations (given moderate environmenttemperatures). The type of crystal cut refers to the crystal symmetry plane andinfluences the stability attributes. Table 3.2 is an extract from [10].

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3.2 Components

Frequency 10 MHzType of crystal cut AT

Initial frequency accuracy < ± 2 ppm (± 20 Hz)Frequency stability versus

Temperature (0 C to +60 C) ± 0, 2 ppm typ.Long term aging < ± 0, 7 ppm first year

Phase noise versus frequency offset1 Hz < −70 dBc/Hz10 Hz < −100 dBc/Hz100 Hz < −132 dBc/Hz1 kHz < −140 dBc/Hz

Output wave form HCMOS square waveLogic high 4, 5 V min.Logic low 0, 4 V max.Duty cycle 40% to 60%Electronic frequency control

Frequency deviation range ±4 ppm min.Control voltage range 0, 0 V to 5, 0 VInput impedance > 47 kΩ

Supply voltage 5, 0 VCurrent draw < 260 mA at turn-on

Table 3.2: Mercury OC14T5A OCXO Specifications.

Table 2.2 shows that the slew rate of the reference input signal is critical. Infact the input is triggered by observing the zero crossings of the reference signal.It is obvious that the HCMOS square wave provided by the OCXO is the preferredsignal for this purpose. When using less steep zero crossing transitions, accuratetriggering becomes more difficult and is prone to timing errors known as jitter,translating into output spectrum noise. The noise is caused by the statisticalnature of the jitter timing errors.

An additional feature is the electronic frequency control (EFC) input thatallows to ”pull” the oscillator frequency fref by applying a DC control voltage atthe EFC pin. This allows to change the output frequency by ±4 ppm (±40 Hz).Reviewing (2.9), the synthesizer output frequency fout is directly proportional tofref . When required, the synthesizer output can be set to an arbitrary centerfrequency within the possible range by fine-tuning fref with EFC.

The LO synthesizer implementation in this diploma thesis leaves the EFCvoltage constant for best noise performance. Moreover, the 12-bit modulus of theADF4153 PLL IC is utilized to produce a frequency step size which is alreadybetter than stated in the requirements.

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3.2 Components

3.2.2 Burr-Brown BUF634 Buffer Amplifier

This amplifier is used as a DC-coupled impedance buffer for the 10 MHz referenceoscillator. The buffer with low output impedance is capable of delivering currentsup to ±250 mA, which certainly allows to trigger the ADF4153 PLL IC referenceinput and at the same time drive a 10 MHz output.

A jumper selects the buffer input, which can be either

- the on-board reference oscillator or

- an external oscillator via input jack.

The buffered reference signal is led to the PLL IC and the 10 MHz output. Thisfeature allows to configure the synthesizer PCB either as ”master” or ”slave”regarding the reference oscillator, which permits different scenarios:

- All LOs use the on-board 10 MHz oscillator, i.e. all LOs are configured as”master”.

- The master LO will provide the reference signal for all other slave LOs.Thus all synthesizer units are in sync because of the mutual reference clock.A slave unit is able to pass the buffered master clock on to the next slaveunit.

- All LOs can also be used in conjunction with one auxiliary external clock,meaning that all units are operating in ”slave” mode.

Specifications

The BUF634 data sheet [11] describes two modes of operation, a low quiescentcurrent mode and a wide bandwidth mode that works with ten times the biascurrent. Of course, the wide bandwidth mode is utilized to use the BUF634 withits full potential.

The amplifier was chosen for its uncompromised large signal bandwidth com-bined with high output current capability, whereas other products have widebandwidth only for small signal operation. This is important, because the ref-erence oscillator signal is a square wave with peak-to-peak value of up to 5V,cf. Table 3.2. Voltage gain is not intended; the amplifier serves as impedancebuffer only. The device is operated with ±12 V on the synthesizer PCB.

3.2.3 Crystek 960-1200 MHz VCO

The VCO pad connections are straightforward: There is the tuning voltage input,the RF output (50Ω), and the Ucc pad for the supply voltage. All other padsconnect to ground.

29

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3.2 Components

Parameter SpecificationRated output current 250 mABandwidth (−3 dB) 160 MHzSlew rate 2 kV/µsVoltage gain magnitude (Rload = 67 Ω) 0,8 min.Input resistance 8 MΩInput capacitance 8 pF

Table 3.3: Burr-Brown BUF634 Specifications for ”Wide Bandwidth Mode”.

Parameter SpecificationOutput frequency 960 MHz ÷ 1200 MHzOutput power 0 dBm ÷ 6 dBmPhase noise power spectral density

1 kHz offset −70 dBc/Hz10 kHz offset −96 dBc/Hz

100 kHz offset −118 dBc/HzHarmonic suppression (2nd harmonic) 10 dBcTuning voltage 0,5 V ÷ 4,5 VTuning sensitivity KV CO 150 MHz/VInput capacitance 30 pFLoad impedance 50 ΩSupply voltage 3,0 V

Table 3.4: Crystek CVCO55BE-0960-1200 VCO Specifications.

Tuning Voltage and Tuning Sensitivity

The VCO tuning voltage requirements are well met by the Analog Devices ADF4153PLL IC, which supports a supply voltage of up to 5, 5 V for the charge pumpoutput. This allows to use the preferred passive loop filter instead of an activefilter.

As the tuning curve, which shows output frequency versus tuning voltage, isnot linear [12], the typical tuning sensitivity is stated. The tuning sensitivity isan important phase-locked loop parameter.

Input Capacitance

The VCO input capacitance naturally influences the loop filter impedance. Aslong as a second order passive loop filter is used, the loop filter components usuallyinclude relatively large capacitors. In comparison, the VCO input capacitance of30 pF is relatively small and can be neglected. Section 3.2.6 will verify that theloop filter capacitances exceed 30 pF by more than three orders of magnitude forthis presented synthesizer. This does not hold true for some passive loop filters

30

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3.2 Components

of higher order. The VCO input capacitance then becomes relevant.

3.2.4 Mini Circuits MAV-11SM Amplifier

The main task of this component is to provide isolation between the synthesizeroutput and the VCO, thus reducing interference caused by unstable load condi-tions. The according isolation from amplifier port 2 (amplifier output) to port 1(amplifier input) is expressed by the scattering parameter S12. In the forwarddirection on the other hand, power gain is provided, expressed by S21.

Frequency |S11|/dB |S21|/dB |S12|/dB |S22|/dB500 MHz −41, 87 12, 10 −15, 80 −43, 17

1000 MHz −44, 14 10, 70 −14, 70 −44, 761500 MHz −44, 66 9, 10 −13, 50 −44, 242000 MHz −43, 46 7, 60 −13, 00 −42, 922500 MHz −42, 48 6, 10 −12, 70 −41, 943000 MHz −41, 44 4, 60 −12, 60 −40, 98

Table 3.5: MAV-11SM Scattering Parameters.

Of primary interest is the behavior of the MAV-11SM first for frequenciesin the range 1087, 5 MHz± 50 MHz. Table 3.5 is an excerpt of the data sheetfrom Mini Circuits, where we gather through interpolation |S12| ≈ −14 dB and|S21| ≈ 10 dB for the center frequency 1087, 5 MHz.

Next, we observe |S21| for the 2nd harmonic at 2175 MHz, where |S21| ≈ 7 dB.Together with the VCO second harmonic suppression of typically 10 dBc, theexpected second harmonic attenuation at port 2 of the amplifier is therefore13 dBc (the fundamental frequency experiences 3 dB more gain than the secondharmonic). In the complete LO system with eight outputs, a passband filter willattenuate the harmonics further. These hardware additions are beyond the scopeof this diploma thesis.

Biasing

For biasing the amplifier, an RFC1 and a DC blocking capacitor separate thequiescent current from the RF signal path. A device voltage Ud = 5, 5 V anda bias current I0 = 60 mA are suggested [13]. Given the supply voltage ofUcc = 12 V, the required resistor RBias can be specified [14]:

RBias =Ucc − Ud

I0

=12 V − 5, 5 V

60 mA= 108, 3 Ω

The RFC has high conductance at DC and can be omitted in the calculation

1Radio Frequency Coil (Choke): An element that acts as inductance up to its resonancefrequency in a RF circuit.

31

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3.2 Components

MAV-11SM

4

1 3

2

BiasR

L (RFC)

Input Output

I0

1,blockC 2,blockC

ccU

dU

Figure 3.3: Biasing the MAV-11SM Amplifier.

above. The power dissipation in RBias of 0,4W is handled by connecting threeresistors in parallel instead of using a single device to ensure safe part tempera-tures.

The application note [14] recommends to use an RFC that has about tentimes the impedance of the load at the lowest frequency of operation, which is1037, 5 MHz. Because of the 50 Ω system implying a 50 Ω load, the coil impedanceZL at this frequency should be about 500 Ω. On the other hand the series reso-nance frequency fres of the RFC must be above the maximum operation frequencyof 1137, 5 MHz. It requires a specialized RFC to have both enough inductance(to isolate the biasing circuitry from RF) and high fres.

For building the circuit, a 68 nH coil with fres = 1200 MHz is used, whichhas ZL = 443 Ω at 1037, 5 MHz. DC-blocking capacitors with Cblock,i = 22 pFare chosen. They have a series resonant frequency just above the highest signalfrequency and are provided in an SMD 0805 package.

3.2.5 Analog Devices ADF4153 PLL IC

The PLL IC requires few external components for operation, mainly decouplingcapacitors are placed near the device. Specific device inputs are emphasizedbelow.

Charge Pump Setting: The resistor Rset sets the maximum charge pump cur-rent. The used default value of Rset = 5, 1 kΩ gives a 5 mA current limit.Importantly, the actual charge pump currents only match the specificationsin [4] if Rset = 5, 1 kΩ.

Complementary RF Input: ”RF IN B” is the complementary input to the RFprescaler. For the intended single-ended operation, it is decoupled to ground

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3.2 Components

with a 100 pF capacitor.

Charge Pump Power Supply: The PLL IC offers the possibility to use ahigher supply voltage for the charge pump section. Other than the usual3, 0 V voltage limit, this circuitry can be powered by up to 5, 5 V and thuscan provide higher tuning voltages for the VCO. Combined with this fea-ture, a passive loop filter with all its advantages is therefore sufficient todrive the used VCO.

Clock, Data and Latch Enable Inputs: These are the serial inputs of the3-wire interface (CLK, DATA, LE). Each input is equipped with a series330Ω resistor, as suggested in the tech note [6].

3.2.6 Loop Filter

The values of the loop filter components are now calculated for the present1087,5 MHz synthesizer using the method explained in Section 2.3.

The loop filter has the topology shown in Figure 2.4, consisting of capacitorsC1 and C2 as well as resistor R2. This passive second order configuration waschosen because of its simplicity.

The reference oscillator’s output fref is frequency-doubled and used as com-parison frequency fPFD:

fPFD = fref ·D

R= 20 MHz,

where D = 2 and R = 1. For fout = 1087, 5 MHz this means for the divide ratiorealized by the PLL IC:

Ntot =fout

fPFD · V= 54, 375.

Because no external prescaler is used, V = 1 here. Using the reference frequencydoubler yields a 3 dB phase noise advantage over the solution with fPFD=10MHzand Ntot=108,75.

The constant Kφ is chosen to the smallest possible value realized by theADF4153 PLL IC with Rset = 5, 1 kΩ, which is Kφ = 313 µA · rad−1 to min-imize the necessary capacitances in the loop filter. If Rset = 5, 1 kΩ, the tableprovided in the datasheet[4], which describes the mapping of the charge pumpprogramming to Kφ, can be used. Rset is realized by R1 in the circuit shown inFigure 3.5.

Starting with the design values φ = 45 for the phase margin, and a loopbandwidth of 10 kHz (ωc = 2π · 10 kHz) results in

T1 =1

ωc

[

1

cos φ− tan φ

]

=1

2π · 104 s−1

[

1

cos(

π4

) − tan(π

4

)

]

= 6, 592 · 10−6 s ,

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3.2 Components

T2 =1

ωc2T1

= 38, 42 · 10−6 s , and

Ctot =Kφ KV CO

Ntot ωc2

[

1 + ωc2T2

2

1 + ωc2T1

2

]1/2

=313 µA · 150 MHz/V

54, 375 · (2π · 104 s−1)2·

[

1 + ωc2T2

2

1 + ωc2T1

2

]1/2

= 528, 0 · 10−9As

V= 528, 0 · 10−9 F.

Ctot denotes the sum capacitance of C1 and C2 in the loop filter. The resultalready hints the substantial capacitor values, given the quality requirementsand the limited space realization with SMD components.

Finally, the loop filter component values are (referring to Figure 2.4):

C1 = Ctot ·T1

T2

= 91 nF

C2 = Ctot − C1 = 437 nF

R2 =T2

C2

= 88 Ω

The interdependence of the part values forbids to simply raise capacitor valuesto get smaller loop bandwidth, because this also alters the phase margin, at therisk of potential closed loop instability. It is recommended to check the resultingnew loop parameters for altered part values. In this case, the chosen values are:

C1 , 100 nF

C2 , 440 nF = 2 · 220 nF

R2 , 90 Ω

These are standard part values (for C2, two parallel capacitors are used). Usingfewer parts and soldering joints reduces complexity. Importantly, all capacitorsare film type of high Q-factor. The indices above comply with Figure 2.4. Forthe part indices used in the actual circuit refer to Section 3.3.

Verification for the actually used parts reveal slightly different values fromφ = 45 and ωc = 2π · 10 kHz:

φ = 43, 4

ωc = 2π · 9, 9 kHz

The frequency step size depends on the modulus F , which is set to the supportedmaximum of the PLL IC, F = 4095, so that the step size is minimal. The divisionfactor Ntot is set

Ntot = N +K

F= 54 +

K

4095

!= 54, 375

and determines the output frequency. Obviously, N is the integer part of thefractional division factor, resulting in N = 54. The above relation gives K = 1536,because only integer fractions K are supported by the PLL IC. The actual mean

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3.3 Schematics and Layout

division factor and calculated output frequency are

Ntot = 54,37509158 ,

f0 = 1087,501832 MHz

if fref = 10 MHz and thus fPFD = 20 MHz. With this precondition, the step sizeof the synthesizer is

fstep =fref

F·DV

R=

10 MHz · 2

4095≈ 4, 884 kHz

with D = 2, V = 1 and R = 1.

3.3 Schematics and Layout

The layout for the complete circuit of the 1087,5 MHz synthesizer is designedto fit on one PCB. The board is made of low-cost FR4 material2 with copperplating on both sides. However, the relative permittivity εr may strongly varybetween board samples. As a result, the proper RF strip line width for 50 Ω linesvaries between samples. In practice, FR4 is preferably used in designs with upto 3 GHz.

One copper layer serves as a ground plane, and all ground connections fromthe top plane are realized with vias. Especially for the RF section, multiple viasare used for one ground connection to decrease inductance and resistance.

For the center frequency of 1087,5 MHz and the properties of the FR4 board(Table 3.6), a width of w = 2, 9 mm is used for a 50 Ω microstripline. Near theIC packages, tapered lines are used because of the small pin distances. All RFmicrostrip lines are made as short as possible.

Parameter ValueRelative permittivity εr 4,4÷ 4,7Substrate thickness h 1,6 mmDielectric loss, tan δ 0,014Copper plating thickness 35 µmCopper resistivity 1, 673 µΩ cm50 Ω microstrip line width w for 1,0875 GHz 2,9 mm

Table 3.6: Properties of the FR4 Circuit Board.

Figure 3.5 shows the schematics of the LO1 synthesizer PCB. The center ofthe circuit is the ADF4153 PLL IC that gets an equivalent of the RF outputsignal, which is then scaled down by the PLL IC by performing a frequencydivision with a factor of Ntot. The result is compared to the reference signal with

2Flame Resistant 4

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3.3 Schematics and Layout

fundamental fref . According to the register programming, a charge pump (CP)output is created.

This output current is filtered by the loop filter R6 and C18, C19, C20 andpassed on to the VCO tuning input (VT). Based on the tuning voltage, the VCOgenerates an RF output. 50 Ω microstrip lines are used for transmission of theRF signal.

A 6 dB power divider consisting of the resistors R2, R3, R4 with ≈ 50

directs 1

4of the VCO output power towards the output amplifier and 1

4towards

the PLL IC for comparison with the reference. The rest of the VCO outputpower is dissipated within the resistors. This 3-port power divider is matched to50 Ω at every port. The DC blocking capacitors C10, C11, C12 (22 pF) are usedthroughout.

The output amplifier MAV-11SM, which is biased by L5, R14, R15 and R16,provides gain and isolates the RF section from the load at the RF output RF OUT.This output is DC-blocked by C13.

Inputs CLK, DATA and LE form the 3-wire interface for frequency control com-munications with the microcontroller (Table 5.2).

Reference oscillator OCXO OC14T5A generates a HCMOS compatible squarewave signal with fundamental fref = 10 MHz. This signal or an external signalREF IN, depending on the setting of the jumper, is transferred to the a high-current, high-bandwidth buffer amplifier BUF634P. From there, it is brought toboth the reference input of the PLL IC and the SMB type REF OUT connector onthe PCB.

The supply voltages are provided by a separate PCB with voltage regulatorsthat is presented in Section A.3.

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3.3 Schematics and Layout

Figure 3.4: Top Layer Layout of the 1087,5 MHz Synthesizer PCB.

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3.3 Schematics and Layout

V+

RF OUT

CVCO55BE-

0960-1200U2

C5

L5

R14

3 1

2

4

C13 C12 R4 R3

R2

R5

C10

C9 R1

R6

C18

C19

C20

C16

C14 C15

C17

L4C11

C1

C2

C3

C4 C6

C7 C8R7 R8 R9

L1

C23C21

L2

C22

C24

C26

C27

+

+

C29 C25

R13

R12

R11

R10

C28

R15 R16

22 pF 22 pF 18 18

18

50

22 pF

100 pF

22 pF

332 332 332

10 pF

10 pF

10 pF 10 pF

10 pF

100 nF

100 nF 100 nF 100 nF

330 330 330

10 nF 1

100 nF10 pF

100

220 nF

220 nF

100 nF

90

5,1 k

100

1 10

1

10

100

110 pF

470

470

10

10

220

220

68 nH

U1

ADF4153BRU

U3BUF634P

U4OC14T5A-10.000

U5

MAV-11SM

3 V

SUPPLY

12 V

SUPPLY

-12 V

SUPPLY

5 V

SUPPLY

CLKDATA

LE

REF

OUT

REF

IN

H

H

H

F

FF

F

F

F

F

F

Vo

Vin V-BW

8

7 1

14

67

1 3 4

9 10 11 12 13 15 16

12345678

REFIN AVDD RFINA RFINB AGND CPGND CP RSET

DGND SDVDD CLK DATA LE DVDD VP

RF VCC

VT

* RF STRIP LINE 50

* * * *

** RF T-JUNCTION 50

**

**

+

+

+

+

+

+

4,4 V

SUPPLY

Figure 3.5: Schematic of the 1087,5 MHz Synthesizer PCB.

38

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Chapter 4

The Phase-Locked LoopSynthesizer for 4252,5 MHz

The second local oscillator (LO2) is a synthesizer with f0 = 4252, 5 MHz, whichreutilizes some of the circuit technology from the synthesizer board described inChapter 3. The whole RF section is newly designed, introducing an externalprescaler frequency divider and an improved circuit board material to meet therequirements of the higher center frequency. In addition, an according loop filterdesign is presented. Figure 4.1 shows a picture of the LO2 synthesizer PCB.

Figure 4.1: Picture of the LO2 4252,5 MHz Synthesizer PCB.

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4.1 Requirements

4.1 Requirements

Table 4.1 summarizes the requirements for the LO2 synthesizer:

Output center frequency 4252,5 MHzOutput frequency range 4227, 5 MHz ÷ 4277, 5 MHzPhase noise power spectral density < −70 dBc/Hz for |∆f | = 10 kHz

< −85 dBc/Hz for |∆f | = 25 kHzSpurious lines < −50 dBc for |∆f | < 50 kHzFrequency step size < 10 kHzCircuit board material Rogers RO4003C 0.032”Reference frequency 10 MHzReference feed internal or externalFrequency control µC typeMain supply voltage 12 V DCPhysical dimensions

Length 160 mm max.Width 80 mm max.Height 14 mm max.

Table 4.1: LO2 Requirements.

4.2 Components

This section introduces the parts the synthesizer is built of. Some parts werealready discussed in detail in the previous chapter and are only listed here.

4.2.1 Overview

Some areas of the synthesizer circuit technology do not depend on the output fre-quency and are reutilized from the 1087,5 MHz synthesizer design from Chapter 3.The following Figure 4.2 emphasizes the main components on the LO2 PCB,which are discussed in the subsequent sections.

40

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4.2 Components

Mercury

OC14T5A

OCXO

Crystek

CVCO55BH

4100-4300

REF IN

Jumper

RF OUT

REF OUTAnalog Devices ADF4153BRU

Burr-Brown

BUF634

Power DividerLoop Filter

Hittite HMC432

Agilent

MGA-82563

Figure 4.2: PCB Overview of the 4252,5 MHz Synthesizer.

These parts from LO1 are identical for the LO2 synthesizer:

- The 10 MHz reference oscillator (Section 3.2.1),

- the BUF634 buffer amplifier (Section 3.2.2), and

- the ADF4153 PLL IC (Section 3.2.5).

However, the PLL IC now requires an external prescaler (Section 4.2.3), becausef0 = 4252, 5 MHz exceeds the RF input specification of 4000 MHz. Furthermore,evidently a new loop filter setup and frequency programming are necessary (Sec-tion 4.2.5).

4.2.2 Crystek 4100-4300 MHz VCO

For the LO2 center frequency f0 = 4252, 5 MHz, a different voltage-controlledoscillator[15] is used. Its characteristics are shown in Table 4.2:

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4.2 Components

Parameter SpecificationOutput frequency 4100 MHz ÷ 4300 MHzOutput power 2 dBm ÷ 6 dBmPhase noise power spectral density

1 kHz offset −47 dBc/Hz10 kHz offset −90 dBc/Hz

100 kHz offset −113 dBc/HzHarmonic suppression (2nd harmonic) 15 dBcTuning voltage 0,5 V ÷ 4,5 VTuning sensitivity KV CO 100 MHz/VInput capacitance 10 pFLoad impedance 50 ΩSupply voltage 5,0 V

Table 4.2: Crystek CVCO55BH-4100-4300 VCO Specifications.

Here the required tuning voltage at the VT port is Utun ≈ 3, 6 V for 4252,5 MHzand Utun ≈ 4, 1 V for the required maximum of 4277,5 MHz. The VCO thereforemakes use of the independent charge pump supply voltage UP of the ADF4153PLL IC (cf. Table 2.2). This circuit section is operated with UP = 4, 4 V toguarantee the required frequency range, while the rest of the PLL IC device usesonly 3 V.

Like the VCO for LO1, the Crystek CVCO55BH-4100-4300 has pads for groundconnections, the supply voltage, the tuning voltage and the RF output.

4.2.3 Hittite HMC432 Prescaler

For the 4252, 5 MHz synthesizer a separate frequency divider (prescaler) is nec-essary in the return path to the PLL phase frequency detector. That is becausethe maximum allowed input frequency of the ADF4153’s frequency divider isonly 4, 0 GHz (cf. Table 2.2). Through the HMC432 divide-by-2 prescaler, theADF4153 receives 1

2· 4, 252 GHz = 2, 126 GHz at the RF input.

The Hittite HMC432 (cf. Table 4.3) features ”ultra low” SSB1 additive phasenoise, operation up to 8 GHz at the input, and single-ended ports[16]. Through-out the synthesizer the signal path is single-ended. According ports on theHMC432 help to keep circuit complexity low and signal quality unimpeded, be-cause conversion between single-ended and balanced signals (with a balun2 is notrequired.

Both the RF input and output require DC blocking because of their circuittopology. The DC blocking capacitors are chosen to have series resonance (lowimpedance) just above the maximum intended operation frequency.

1Single Sideband2Balanced–Unbalanced Converter

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4.2 Components

Parameter SpecificationInput frequency 0, 2 ÷ 8 GHzOutput power (fin = 4 GHz) −6 dBm ÷ −3 dBmInput power range (fin = 1 ÷ 7 GHz) −12 dBm ÷ 12 dBmSSB phase noise power spectral density

100 kHz offset −148 dBc/HzReverse leakage (RF output terminated, fin = 4 GHz) −30 dBmSupply voltage 3,0 VSupply current draw 42 mA

Table 4.3: Hittite HMC432 Divide-By-2 Specifications.

4.2.4 Agilent MGA-82563 Amplifier

The task of this amplifier is to provide gain to the RF signal and to improveisolation between the synthesizer RF output port and the VCO by attenuatingwaves reflected towards the VCO.

Parameter SpecificationInput frequency 0, 1 ÷ 6 GHzGain (at 4 GHz) 10, 7 dBOutput power at 1 dB gain compression P1dB +17, 0 dBmOutput third order intercept point +31, 0 dBmNoise figure 2, 9 dB max.Input VSWR 1, 8 : 1Output VSWR 1, 2 : 1Supply voltage 3,0 VSupply current draw 84 mA

Table 4.4: Agilent MGA-82563 Amplifier Specifications.

This GaAs PHEMT3 amplifier has beneficial attributes like unconditional sta-bility, good matching at the input and output ports to a 50 Ω system and high1 dB compression point P1dB. Table 4.4 gives a quick overview of the specifica-tions, while typical scattering parameters according to [17] are shown in Table 4.5.Port 1 is the amplifier input, port 2 is the output.

At the operation frequency f0 = 4252, 5 MHz, |S12| = −20 dB, which con-tributes to the isolation of the load at port 2 from the PLL at port 1. At thesame time the device features |S21| ≈ 10, 4 dB gain in the forward direction atf0.

As seen in the schematics (Figure 4.4) the MGA-82563 is biased by a RFCwith L = 22 nH at the output (pin 6) like suggested in the data sheet[17]. DC

3Pseudomorphic High Electron Mobility Transistor

43

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4.2 Components

Frequency |S11| |S21|/dB |S12|/dB |S22|GHz

3, 0 0, 28 11, 84 −21 0, 113, 5 0, 28 11, 24 −21 0, 124, 0 0, 29 10, 67 −20 0, 134, 5 0, 30 10, 11 −20 0, 155, 0 0, 32 9, 58 −19 0, 165, 5 0, 34 9, 07 −19 0, 18

Table 4.5: MGA-82563 Typical Scattering Parameters.

blocking capacitors in 0603 SMD packages with 1, 8 pF are present at the amplifierinput and output. The DC block also has low impedance at the operationalfrequency f0 = 4252, 5 MHz, and the capacitor is therefore chosen to have itsseries resonance slightly above the highest frequency of operation (also see thepart list A.2).

4.2.5 Loop Filter

This synthesizer has a second order passive loop filter like shown in Figure 2.4.All filter component values are calculated in this section.

To boost phase noise performance by 3 dB, the frequency doubler feature ofthe PLL IC is engaged (D = 2, R = 1) to obtain

fPFD = fref ·D

R= 20 MHz.

As a consequence of the maximum rated input frequency of 4 GHz at the PLL IC’sRF input, an external frequency prescaler V = 2 is introduced. The VCO outputfrequency fout = 4252, 5 MHz therefore produces an 2126, 25 MHz input at thePLL IC. With the following, the divider factor equation can be solved for thefraction K. The fact that only integer values of K are possible must be regarded.

fout = fPFD · Ntot · V = 20 MHz ·

(

N +K

F

)

· 2

= 20 MHz ·

(

106 +K

4095

)

· 2!= 4252, 5 MHz

For minimum frequency step size, the modulus F is programmed to the supportedmaximum of F = 4095. N is the integer part of the division factor: in this case,N = ⌊4252,5

2·20⌋ = 106. This means for the fraction: K = 1280. With these settings,

the actual mean division factor Ntot and center frequency f0 will be

Ntot ≈ 106, 312576

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4.3 Schematics and Layout

f0 ≈ 4252, 503052 MHz

at a frequency step size of

fstep =fref

F·DV

R=

10 MHz · 4

4095≈ 9, 768 kHz

if fref = 10 MHz. Because of the divide-by-2 prescaler, an actual frequencychange of ∆f at the VCO causes a frequency change of ∆f

2at the PLL IC input.

This results in the equivalent tuning sensitivity

K ′

V CO =KV CO

V= 50 MHz/V.

For calculating the loop filter component values, also the loop bandwidth ωc andthe phase margin φ are required. I have chosen a loop bandwidth of 10 kHz(ωc = 2π · 104 s−1) and a phase margin φ = 50 for minimum RMS phase errors.The phase detector constant Kφ was programmed to 2, 5 mA·rad−1. With calcu-lated T1, T2 and Ctot by means of Equations (2.23)–(2.25) the chosen parts are(2.26)–(2.28):

C1 , 100 nF,

C2 , 660 nF = 3 · 220 nF,

R2 , 63 Ω.

This results in a loop bandwidth of 10,3 kHz and a phase margin φ = 50, 1. Inthe schematic depicted in Figure 4.4, the loop filter consists of the parts R13, C25,C26, C27 and C28.

4.3 Schematics and Layout

In Figure 4.4, the schematics are depicted. The layout for the circuit board(cf. Table 4.6) was created with the components and transmission lines on thetop side of the PCB. A ground plane is present on the bottom side of the circuitboard. Vias are used for establishing contact to circuit ground. Especially in theRF section, multiple vias are required for proper connection to ground (resultingin reduced via inductance and resistance).

The RF output of the synthesizer is generated by the VCO, CVCO55BH.The DC-blocking capacitor C17 is placed between the VCO and the 6 dB powerdivider consisting of R7, R8 and R9, ≈ 50

3Ω each. The outputs of the power

divider lead to the RF output amplifier MGA-82563 and the HMC432 divide-by-2prescaler, which forms the return path to the RF input of the PLL IC, RFINA. TheDC-blocking capacitors C15, C16, C17, C18 are chosen to have series resonance justabove the maximum synthesizer frequency f0,max = 4, 2775 GHz. Transmissionlines in the RF section are 50 Ω microstrip lines with a width w =1,8mm. Near

45

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4.3 Schematics and Layout

the device input pins, the microstrip lines are tapered where required to meet theactual pin pitch requirements.

The PLL IC receives the HCMOS reference signal with fundamental frequencyfref = 10 MHz at the REFIN input. It is compared to the divided RF output ofthe divide-by-2 frequency prescaler HMC432 coming to the PLL IC at the single-ended RF port RFINA. After the frequency conversion, the DC-blocking capacitorsC10 and C11 have series resonance slightly above

f0,max

2= 2138, 75 MHz for best

signal transmission. The prescaler output is terminated by R12 = 50 Ω.

Parameter ValueRelative permittivity εr 3, 38 ± 0, 05Substrate thickness h 0,813 mmDielectric loss, tan δ 0,0024Copper plating thickness 35 µmCopper resistivity 1, 673 µΩ cm50 Ω microstrip line width w 1,8 mm

Table 4.6: Properties of the RO4003C 0.032” Circuit Board Material.

The comparison performed by the phase-frequency detector yields a currentsource (”charge pump”) output at pin CP. By passing the loop filter consisting ofR13, C25, C26, C27 and C28, the charge pump output generates the tuning voltagefor the VT frequency control input of the VCO.

Depending on the jumper setting, either the HCMOS square wave output ofthe internal reference oscillator OC14T5A with fundamental fref = 10 MHz, oran external reference connected to the REF IN input of the PCB, are passed onto the BUF634 buffer. This buffered signal is present at the reference output REFOUT connector of the PCB and also led to the REFIN input pin of the PLL IC.

The data input pins CLK, DATA and LE of the PLL IC are the 3-wire interfacefor communications with the µC for frequency controlling purposes.

Power is supplied by a specially designed DC regulator PCB, which is pre-sented in Section A.3 of the Appendix.

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4.3 Schematics and Layout

Figure 4.3: Top Layer Layout of the 4252,5 MHz Synthesizer PCB.

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4.3 Schematics and Layout

CVCO55BH-

4100-4300

U1

ADF4153BRU

U5

9 10 11 12 13 15 16

12345678

REFIN AVDD RFINA RFINB AGND CPGND CP RSET

DGND SDVDD CLK DATA LE DVDD VP

RF VCC

VT

* RF STRIP LINE 50

** RF T-JUNCTION 50

V+U3

BUF634P

Vo

Vin V-BW

67

1 3 4

U4OC14T5A-10.000

8

7 1

14

L2

68 H

R11

R10

470

470

C35 C36110 pF F+

C31

C32

1

10

F

F+

+

C30

C29

+

+

10

10

F

F

C34C331 10 FF

+ +

L5

100 H

C5C3

C4 C6

C7 C8

10 pF 10 pF

10 pF

100 nF 100 nF

100 nF

R1

5,1 k

R13

C25

C28

C27 220 nF

220 nF

100 nF

63

C26 220 nF

C21 C23

10 nF

100 nF10 pF

F1

+

C22 C24

R2 R3 R4

330 330 330

C1

C2

R6

R5

10 pF

100 nF

220

220

C9100 pF

C106,8 pF

R12

50

C116,8 pF

C151,8 pF

C171,8 pF

C161,8 pF

C181,8 pF

R918

R718

R818

L4100 H

C12

C13

10 nF

1 nFF1C14

+

L368 H

L1100 H

L622 nH

F1C20 +

+100 pFC19

U6

HMC432

U2MGA-82563

2

VCC

3

5 6

GNDIN

OUT

GND

2 31

5 46

GNDOUT

IN

CLKDATA

LE

REF

OUT

REF

IN

12 V

-12 V

5 V

4,4 V

3 V

RF OUT *

*

*

*

**

**

*** TAPERED RF LINE

***

***

***

***

Figure 4.4: Schematic of the 4252,5 MHz Synthesizer PCB.

48

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Chapter 5

Setting Output Frequencies withthe TI Microcontroller

The synthesizer requires programming to set a desired output frequency. Allnecessary information is stored in the registers on the PLL IC. To access theseregisters, the IC has a control interface, the 3-wire interface, which gets inputdata from a low-current microcontroller from Texas Instruments1. In a bit-serialmanner, the µC sends control words of up to 24 bits length to the PLL IC. Tofinally obtain a frequency output, a set of four control words is transferred.

This chapter describes how to derive the control data words and how theyare sent to the PLL IC. I have developed a microcontroller program that handlesthe syntax and timing of the transfer. The assembler program code is shown inSection 5.3.

5.1 Generating PLL IC Register Data Sets

A data set, as described in this section, assigns custom values to all the PLL ICregisters. Thus, it is possible to set an output frequency and different modes ofoperation as well as tuning the PLL values to fit the setup. As shown in the PLLIC documentation [4], the control information is organized in four control words,which are identified by the control bits C2 and C1:

Register C2 C1N Divider Register 0 0R Divider Register 0 1Control Register 1 0Noise and Spur Register 1 1

Table 5.1: Truth Table of the Control Bits C2 and C1.

1The model used is the MSP430F149

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5.1 Generating PLL IC Register Data Sets

The registers are divided in several bit fields of different length to accommo-date all control values:

N Divider Register: This register contains two parameters that immediatelyinfluence the output frequency, namely the integer division factor N in theform of INT and the fraction K, represented by FRAC. Bit 23 (FASTLOCK) willalways set the maximum charge pump current, regardless of the CP CURRENT

setting in the control register. For this application, bit 23 is not set.

23 22 14 13 2 1 0

FA

ST

LO

CK

0 0INT FRAC

Figure 5.1: N Divider Register Map.

The value written to the N Divider Register is therefore:

N Divider Register = N · 214 + K · 22 (5.1)

R Divider Register: The R Divider scales down fref from the reference oscil-lator by the division ratio R. MOD contains the value for the modulus F .Bit 18 (PRESCALER) switches the internal prescaler of the ADF4153 between4/5 (bit not set) and 8/9 (bit set). A prescaler value 8/9 is required forPLL IC input frequencies above 2 GHz, see [4] for further information. Theunspecified bits are cleared per default.

23 22 14 13 2 1 0

0 1

20 19 18 17

LO

AD

CO

NT

RO

L

RE

SE

RV

ED

PR

E-

SC

AL

ER

MODR COUNTERMUXOUT

Figure 5.2: R Divider Register Map.

R Divider Register = PRESCALER · 218 + R · 214 + F · 22 + 1 (5.2)

Control Register: By setting bit 11, the reference frequency doubling can beenabled. If this bit is set, it has the function of D=2 with respect toEquation (2.8) ff. Bits 10 to 7 program the charge pump (current source)plateau. See [4] for the mapping bits vs current. Important is also thePD POLARITY bit, that must be set for passive loop filters if the VCO slopeof frequency vs control voltage is positive.

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5.2 3-Wire Interface

15 2 1 0

1 0

12 11 10 9 7 6 5 4 3

RE

F.

DO

UB

LE

CP

/2

PD

PO

LA

RIT

Y

LD

P

PO

WE

R-

DO

WN

CP

3-S

TA

TE

CO

UN

TE

R

RE

SE

TCP

CURRENTRESYNC

Figure 5.3: Control Register Map.

Control Register = (D − 1) · 211 + (CP/2) · 210 +

+ (CP CURRENT) · 27 +

+ (PD POLARITY) · 26 + 2 (5.3)

Noise and Spur Register: The NOISE AND SPUR MODE bits enable built-in op-timizations for best noise performance or best spur suppression. Setting thebits 9 to 6 as well as bit 2 enables the ”Lowest Noise Mode” of the PLL IC.The opposite optimization is the ”Lowest Spur Mode”, which is selected byclearing the bits 9 to 6 and bit 2. It is also possible to set a mode with acombined approach for both noise and spur reduction.

2 1 0

1 1

10 9 6 5 3

RE

SE

RV

ED

NO

ISE

AN

D S

PU

R

MO

DENOISE AND SPUR

MODERESERVED

Figure 5.4: Noise and Spur Register Map.

To enable the ”Lowest Noise Mode”, the register value is

Noise and Spur Register = 15 · 26 + 22 + 3 = 967 = 3C7h.

The ”Lowest Spur Mode” is selected by setting the register value

Noise and Spur Register = 3h.

5.2 3-Wire Interface

The ADF4153 PLL IC has a 24-bit shift register for user data input. In thissection the use of the 3-wire interface and the programming syntax of the IC isexplained.

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5.2 3-Wire Interface

The 3-wire interface lines are

- Clock (CLK)

- Data (DATA)

- Latch Enable (LE).

Data is first transferred in serial manner into the 24-bit input shift register, eachbit being clocked in on the rising edge of CLK. The MSB2 is entered first, finishingwith the LSB3. The last to bits entered into the shift register will be interpretedas the control bits C2 and C1, whereas C1 is the LSB. Then, on the rising edgeof LE, data is transferred into the destination control register determined by thecontrol bits, cf. Table 5.1. To load the full register data set, four consecutive datawords are transferred. Figure 5.5 shows the timing constraints of the ADF4153

6t

Bit 3

1t

t

t

t

Bit 2 Bit 1 Bit 0 (LSB) Bit 23 (MSB) Bit 22

Data Word i+1Data Word i

Voltage

0 V

3 V

0 V

3 V

Voltage

0 V

3 V

VoltageCLK

DATA

LE

1t

6t

… LE Setup Time

… CLK to LE Setup Time

Figure 5.5: ADF4153 3-Wire Interface Timings.

3-wire interface. The transfer data rate is not critical, because the time from afrequency change initiation to PLL lock is not critical in this application. Sometiming parameters must be considered also for low data rate transmission. Theminimum recommended LE setup time and the CLK to LE setup time from [4]must be regarded.

It must be emphasized that in order to set a new modulus value, the N DividerRegister must be written after the R Divider Register has changed. Thus writingto the R Divider Register implicates a subsequent write to the N Divider Register.This restriction exists due to the manufacturer’s specifications. The program I

2Most Significant Bit3Least Significant Bit

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5.3 MSP430F149 Microcontroller Program

have developed for loading the register values to the ADF4153 takes this intoaccount by the byte order of the data block (refer to Section A.1 for the completeprogram listing). A valid programming sequence is therefore:

1. Send the ”R Divider Register” data.

2. Send the ”Control Register” data.

3. Send the ”Noise and Spur Register” data.

4. Send the ”N Divider Register” data.

5.3 MSP430F149 Microcontroller Program

The MSP430F149 controller from Texas Instruments is a 8/16-bit low-current devicewhich is equipped with 60 kB flash memory and 2 kB RAM. The program code Ihave developed stores the register data sets as constants in the µC memory. Twosets of 3-wire interface connections are driven simultaneously, one for program-ming the 1087,5 MHz synthesizer and a second for the 4252,5 MHz synthesizer.For this task, 6 pins of the µC port P1 are used as outputs. By starting the µCprogram, the data sets consisting of four 24-bit control words per synthesizer aretransferred to the PLL ICs automatically.

The program code is designed to fully support the µC low power mode: Afteran initialization sequuence, the controller is put in the energy-saving state LPM4.A timer-controlled interrupt service routine handles the data output at port P1.A timer is set up to generate interrupts at constant intervals to establish a timebasis for the clock signal CLK. On invocation, the ISR5 executes only the nec-essary commands to provide updated output, and the program causes the µC towait in LPM until the next CLK state change.

The program starts with basic initializations. The used port P1 register bitsare set up as outputs: P1.0 to P1.2 for the 1087,5 MHz synthesizer6 and P1.4 toP1.6 for the 4252,5 MHz synthesizer. Afterwards, registers used as loop variablesare initialized, namely r7 with the number of transmit bytes per data set and r12

containing the length of the ADF4153 shift register in bytes. Indirect addressingwith the value in r5 as offset is used to access the control data sets for bothsynthesizers, storing each read byte in r9 and r10, respectively. After one byte isprocessed, the offset value in r5 will be increased to point to the next data byte.Bit 0 of register r6 contains the CLK state, i.e. r6=1 indicates that CLK=high.The actual main program just waits in low-power mode for the timer interrupt.

4Low Power Mode5Interrupt Service Routine6Px.y denotes bit y of port x

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5.3 MSP430F149 Microcontroller Program

For emphasis, important portions of the program code are presented here.A full listing is given in Section A.1. The first instructions set up the timer,enable interrupt triggering and declare the port 1 output bits. The suffix .b

induces an 8-bit access, while .w stands for 16-bit processing:

mov.w #WDTPW+WDTHOLD,&WDTCTL

bis.b #77h,&P1DIR

mov.w #CCIE,&CCTL0

mov.w #COUNT,&CCR0

mov.w #TASSEL_2+MC_2,&TACTL

The first data bytes are read from memory, the CLK output is set and the low-power mode is enabled with the following instructions:

mov.b send_me_1GHz(r5),r9

mov.b send_me_4GHz(r5),r10

mov.b #1,r6

mov.b &P1OUT,r15

and.b #0BBh,r15

bis.b #11h,r15

mov.b r15,&P1OUT

bis.w #CPUOFF+GIE,sr

nop

The code responsible for data readout and output resides in the interruptservice routine, which is invoked in regular intervals by the timer interrupt.

By the xor instruction in the following step bit 0 of register r6 is toggled.This register represents the CLK state.

toggle

xor.b #1,r6

mov.b r6,r14

rla.b r14

rla.b r14

rla.b r14

rla.b r14

bis.b r6,r14

mov.b &P1OUT,r15

and.b #0EEh,r15

bis.b r14,r15

mov.b r15,&P1OUT

In the subsequent steps, bit rotation is executed by the rla instructions. Theand instruction is used to clear only the associated CLK bits of r15, which holds

54

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5.3 MSP430F149 Microcontroller Program

the value of register P1. By using the bis instruction, the CLK bits P1.0 andP1.4 of the 3-wire interface are updated.

The MSB of a control word must be sent first to the PLL IC. This is arrangedby rotating the data byte left through carry, i.e. the former MSB appears in thecarry bit. With the adc instruction, the bit is added to the cleared7 registerr4. Finally, the result is in turn rotated left one time to assign the 1087,5 MHzsynthesizer DATA output to P1.1.

xor r4,r4

rlc.b r9

adc.b r4

rla.b r4

In similar fashion, the 3-wire DATA bit for contacting the 4252,5 MHz synthesizeroccurs at port P1.5:

xor r11,r11

rlc.b r10

adc.b r11

rla.b r11

rla.b r11

rla.b r11

rla.b r11

rla.b r11

mov.b &P1OUT,r15

and.b #0DDh,r15

bis.b r4,r15

bis.b r11,r15

mov.b r15,&P1OUT

Now the clocking and data outputs of the 3-wire interface have been dealt with.Only the latch enable signal is left to be sent. Within the nested code loops,the LE output is set to indicate the complete transfer of 24 data bits into theADF4153 shift register.

mov.b #1,r13

mov.b &P1OUT,r15

bis.b #44h,r15

mov.b r15,&P1OUT

7all-zero

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5.3 MSP430F149 Microcontroller Program

LE is cleared by:

mov.b &P1OUT,r15

and.b #0BBh,r15

mov.b r15,&P1OUT

xor.b r13,r13

Thus ports P1.2 and P1.6 form the LE output of the 3-wire interface.

Table 5.2 shows the associated controller ports for the 3-wire interfaces ofboth synthesizers.

Synthesizer CLK DATA LE1087,5 MHz P1.0 P1.1 P1.24252,5 MHz P1.4 P1.5 P1.6

Table 5.2: Mapping: Controller Ports to 3-Wire Interface.

The data sets to transfer are declared at the end of the program, for example,a valid data set for programming the 1087,5 MHz synthesizer is:

DB 10h, 7Fh, 0FDh

DB 00h, 0Ch, 62h

DB 00h, 03h, 0C7h

DB 0Dh, 98h, 00h

The data set is referenced by the address of the send_me_1GHz-label.

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Chapter 6

Performance Measurements

In this chapter, both synthesizers LO1 and LO2 will be programmed to the cen-ter frequencies 1087,5 MHz and 4252,5 MHz, respectively. Each RF output isobserved by means of a spectrum analyzer to assess the synthesizer performance.Several synthesizer program setups are examined.

6.1 Setup

A synthesizer LO1 unit (f0,1 = 1087, 5 MHz) consists of the LO1 synthesizerPCB from Chapter 3, the power supply including the DC voltage regulator PCB(cf. Appendix A.3), and the microcontroller described in Chapter 5. These com-ponents are assembled within a 19-inch enclosure. Furthermore, a combination ofbandpass filter and amplifier on a separate PCB were added after the synthesizerPCB output.

Figure 6.1: Synthesizer Component Arrangement within the 19-Inch Enclosure.

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6.1 Setup

Figure 6.1 shows the arrangement of the synthesizer components within theenclosure. The upper left corner of the picture shows an RF power divider witheight outputs for both LO1 and LO2 (not used during the measurements). Pro-ceeding clockwise in Figure 6.1, the voltage supply PCB, the analog 12V sup-ply, the 4252,5MHz synthesizer PCB including an RF filter, the µC and the1087,5MHz synthesizer PCB can be seen.

There were no efforts to optimize the standardized analog 12V DC supplythat is also situated in the same 19-inch enclosure. Voltage noise filtering andstabilization were improved by the DC regulator PCB I have designed and built.The results in the next section can be considered as an overall synthesizer systemperformance1.

PC

B w

/ D

C

Reg

ula

tors

LO1

PCBLO2

PCB

19" Enclosure

uC 12V DC

Supply

Spectrum Analyzer

JTAG

AC Mains

4252,5 MHz1087,5 MHz

Network Bridge

LAN

PC

Matlab

GPIB

(terminated)

Figure 6.2: Synthesizer Hardware Setup for Measurement of LO1.

Figure 6.2 depicts the 19-inch synthesizer unit containing the LO1 and LO2circuit boards in the setup with the spectrum analyzer. The measurement datais read and stored by a workstation PC. A MATLAB program executed on a PCaccesses the spectrum analyzer by its GPIB interface. Further MATLAB codeserves to generate diagrams based on the data from the spectrum analyzer. Thefollowing measurements include the added bandpass filter and amplifier.

1To characterize the synthesizer circuit board alone, it must be operated within an envi-ronment of peak performance reference components. This affects the power supply as well asthe casing and the separate output amplifier. For this project, only the overall synthesizerperformance is of interest, hence the proposed setup.

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6.2 Results

6.2 Results

To verify the required operation, first LO1 is tuned to the center frequency f0. Iffref = 10 MHz, the expected output will occur at f0=1087,501832 MHz (cf. Chap-ter 3). For all measurements, the on-board 10 MHz oscillator (Section 3.2.1) isused as reference. The ADF4153 PLL IC is programmed as follows for a step sizeof fstep=4,884 kHz.

R Divider Register: prescaler=4/5, R = 1, F = 4095

N Divider Register: N = 54, K = 1536

Control Register: D = 2, Kφ = 313 µA · rad−1 (CP/2=1, CP CURRENT=0)

Noise and Spur Register: NOISE AND SPUR MODE = ”Lowest Noise Mode”

This results in fPFD = 20 MHz, ωc = 62, 204 · 103 s−1, and φ = 43, 4. The loopfilter components are as derived in Section 3.2.6.

Figure 6.3 shows the output spectrum of the LO1 synthesizer near the centerfrequency measured with the analyzer’s resolution bandwidth RBW = 100 Hz,i. e. the plot shows the power levels within a 100 Hz frequency band. Normalizingthis plot to a resolution bandwidth of RBW = 1 Hz gives the calculated powerspectral density expressed in dBc/Hz as shown in Figure 6.4.

59

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6.2 Results

−50 −40 −30 −20 −10 0 10 20 30 40 50−90

−80

−70

−60

−50

−40

−30

−20

−10

0

RBW=100Hz f0=1.0875GHz P

0=−20.7dBm EXT.ATT=20dB

∆f/kHz

P/d

Bc

Figure 6.3: Measured LO1 Spectrum: RBW=100Hz, Lowest Noise Mode.

−50 −40 −30 −20 −10 0 10 20 30 40 50

−110

−100

−90

−80

−70

−60

−50

−40

−30

−20

−10

0

f0=1.0875GHz P

0=−20.7dBm EXT.ATT=20dB

∆f/kHz

Pow

er S

pect

ral D

ensi

ty [d

Bc/

Hz]

Figure 6.4: Calculated LO1 Power Spectral Density: Lowest Noise Mode.

60

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6.2 Results

Now the performance of the LO2 synthesizer from Chapter 4 will be re-viewed. All presented output spectrum plots have been achieved with the loopfilter from Section 4.2.5. At first, operation at the required center frequencyf0 = 4252, 5 MHz with a step size of only fstep = 9, 768 kHz is examined. ThePLL IC register contents are derived from the parameters

R Divider Register: prescaler=8/9, R = 1, F = 4095

N Divider Register: N = 106, K = 1280

Control Register: D = 2, Kφ = 2, 5 mA · rad−1 (CP/2=1, CP CURRENT=111b)

Noise and Spur Register: NOISE AND SPUR MODE = ”Lowest Noise Mode”

for fPFD = 20 MHz, ωc = 64, 717 · 103 s−1, and φ = 50, 1. Figure 6.5 shows theoutput of the measurement with a resolution bandwidth RBW = 100 Hz, whichresults in the calculated power spectral density plot depicted in Figure 6.6.

The origin of the dual spurious spectral lines can be investigated by alteringthe software setup: when switching the register NOISE AND SPUR MODE to the”Lowest Spur Mode” optimization in an attempt to resolve the issue, both spursvanish. Unfortunately, the phase noise is raised in the process. This suggeststhat the ADF4153 PLL IC’s fractional interpolator strategy may be responsiblefor the unwanted spurious lines: the artifacts can be removed at the expense ofphase noise performance. A graphical comparison of the ”Lowest Spur Mode”and the original setup can be seen in Figure 6.7.

The appearance of the spurious artifacts depends on the chosen center fre-quency f0. There exist special cases of the synthesizer frequency programmingwhere no spurs occur: measurements for the parameters N = 106, K = 0 thatresult in f0 = 4240 MHz showed no spurious artifacts. In this special case, thecenter frequency f0 = 4240 MHz is an integer multiple of V · fPFD = 40 MHz.In Figure 6.8, a comparison of this special case measurement with the previouslyobtained result for f0 = 4252, 5 MHz is shown.

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6.2 Results

−50 −40 −30 −20 −10 0 10 20 30 40 50−80

−70

−60

−50

−40

−30

−20

−10

0

RBW=100Hz f0=4.2525GHz P

0=−12.0dBm EXT.ATT=20dB

∆f/kHz

P/d

Bc

Figure 6.5: Measured LO2 Spectrum: RBW=100Hz, Lowest Noise Mode.

−50 −40 −30 −20 −10 0 10 20 30 40 50−100

−90

−80

−70

−60

−50

−40

−30

−20

−10

0

f0=4.2525GHz P

0=−12.0dBm EXT.ATT=20dB

∆f/kHz

Pow

er S

pect

ral D

ensi

ty [d

Bc/

Hz]

Figure 6.6: Calculated LO2 Power Spectral Density: Lowest Noise Mode.

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6.2 Results

−50 −40 −30 −20 −10 0 10 20 30 40 50−80

−70

−60

−50

−40

−30

−20

−10

0

RBW=100Hz f0=4.2525GHz P

0=−12.0dBm EXT.ATT=20dB

∆f/kHz

P/d

Bc

Lowest Noise ModeLowest Spur Mode

Figure 6.7: Measured LO2 Lowest Noise vs Lowest Spur Mode: RBW=100Hz.

−50 −40 −30 −20 −10 0 10 20 30 40 50−90

−80

−70

−60

−50

−40

−30

−20

−10

0

RBW=100Hz P0=−12.0dBm EXT.ATT=20dB

∆f/kHz

P/d

Bc

f0=4252,5 MHz

f0=4240 MHz

Figure 6.8: Measured LO2 Spectra in Lowest Noise Mode: RBW=100Hz.

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Summary

In this diploma thesis, I have designed and built two PLL circuits which areequipped with fractional-N frequency dividers. The circuits are programmablefrequency synthesizers and are used as local oscillators (LO) in a 5,2 GHz ra-dio system: I have designed the first synthesizer LO1 for a center frequencyof f0,1=1,0875GHz and the second synthesizer LO2 for a center frequency off0,2=4,2525GHz. The design process also included market research and partselection. The programmable fractional-N divider adds the flexibility that isrequired in rapid prototyping: the achieved smallest frequency step sizes offstep,1=4,884 kHz for LO1 and fstep,2=9,768 kHz for LO2, respectively, free theradio system from fixed channel raster constraints. The synthesizers feature anoutput frequency range of f0,1 ± 50MHz and f0,2 ± 25MHz, respectively. Foroperating the frequency synthesizers from a standard 12V supply, I have furtherdesigned and built a specialized voltage regulator board with multiple outputs.

Besides designing and building the synthesizer hardware, I have developedthe software for an extensive synthesizer control using a 8-/16-bit microcontrollerfrom Texas Instruments. My assembler program directly generates the required3-wire interface outputs at a microcontroller port.

Finally, I have characterized the synthesizers inside a 19-inch enclosure thatalso contains the microcontroller, an analog 12V power supply, and output ampli-fiers with filters. For both synthesizers, I have calculated the power spectraldensities based on the results of RF output spectrum measurements. For LO1,measured with the center frequency f0,1=1,0875GHz, the phase noise power spec-tral density is −90 dBc/Hz at |f − f0,1|=10 kHz. LO2 measurements with thecenter frequency f0,2=4,2525GHz yielded a phase noise power spectral density of−75 dBc/Hz at |f − f0,2|=10 kHz.

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Acknowledgments

I want to thank Arpad L. Scholtz and the Christian Doppler Laboratory formaking this diploma thesis possible. Also, many thanks go to my supervisorRobert Langwieser for his support throughout the diploma thesis.

Furthermore, I want to thank the friends and colleagues from university forthe good time and fruitful discussions.

My parents and family receive my respectful gratitude for their support of mystudies in many aspects.

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§

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Appendix A

Additional Documentation

A.1 Microcontroller Program Listing

#include "msp430x14x.h"

#define COUNT 20000

#define BYTECOUNT 12

org 1100h

reset ; *** Program start ***

mov.w #0A00h,sp ; Initialize stack pointer

mov.w #WDTPW+WDTHOLD,&WDTCTL

bis.b #77h,&P1DIR ; outports

mov.w #CCIE,&CCTL0

mov.w #COUNT,&CCR0 ; Determine CLK rate

mov.w #TASSEL_2+MC_2,&TACTL

xor.w r5,r5 ; Clear r5

mov.b #BYTECOUNT,r7 ; Number of bytes left

; to transfer

mov.b #8,r8 ; 8 bit / byte

mov.b #3,r12 ; 24 bit = 3 byte

xor.b r13,r13 ; Clear r13

mov.b send_me_1GHz(r5),r9 ; Load "1 GHz Synthesizer"

; data byte to r9

mov.b send_me_4GHz(r5),r10 ; Load "4 GHz Synthesizer"

; data byte to r10

mov.b #1,r6 ; set CLK

mov.b &P1OUT,r15

and.b #0BBh,r15

bis.b #11h,r15

mov.b r15,&P1OUT ; Set initial outports

bis.w #CPUOFF+GIE,sr ; Wait in Low Power Mode

nop

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A.1 Microcontroller Program Listing

;*** INTERRUPT SERVICE ROUTINE

ta0_isr

add.w #COUNT,&CCR0 ; Reinitialize timer

; counter

tst.b r13 ; LE set?

jz toggle

xor.b #1,r6 ; LE set, do not change r6

toggle

xor.b #1,r6 ; Toggle CLK state

mov.b r6,r14 ; Copy CLK state to r14

rla.b r14

rla.b r14

rla.b r14

rla.b r14 ; Rotate left (4 times)

; Gives CLK for the

; 4 GHz synthesizer

bis.b r6,r14 ; Overlay CLK of the

; 1 GHz synthesizer

mov.b &P1OUT,r15

and.b #0EEh,r15

bis.b r14,r15

mov.b r15,&P1OUT ; Update outports

tst.b r12 ; 24 bit word transferred?

jnz no_le

tst.b r6 ; CLK set?

jnz eoisr

tst.b r13 ; LE set?

jnz reset_le

mov.b #1,r13 ; LE already low

mov.b &P1OUT,r15

bis.b #44h,r15 ; Set LE

mov.b r15,&P1OUT

jmp eoisr ; 24 bit word transfer

; complete, end ISR

reset_le

mov.b &P1OUT,r15

and.b #0BBh,r15 ; Clear LE outports

mov.b r15,&P1OUT

xor.b r13,r13 ; Clear LE flag

mov.b #3,r12 ; Reinitialize data byte

; count

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A.1 Microcontroller Program Listing

no_le

tst.b r7 ; All data bytes sent?

jnz not_done

; All data sent

and.b #088h,&P1OUT ; Clear P1.0 to P1.2 and

; P1.4 to P1.6

mov.w #TASSEL_2+MC_0,&TACTL ; Timer A -> Stop Mode

; No more ISR calls!

jmp eoisr

not_done ; More data to send

tst.b r6

jnz eoisr

xor r4,r4 ; Clear r4

rlc.b r9 ; Rotate "1 GHz

; Synthesizer" data

; byte left through

; Carry -> MSB first

adc.b r4 ; Carry bit -> r4 LSB

rla.b r4 ; Shift to bit 1

xor r11,r11 ; Clear r11

rlc.b r10 ; Rotate "4 GHz

; Synthesizer" data

; byte left through

; Carry -> MSB first

adc.b r11 ; Carry bit -> r11 LSB

rla.b r11

rla.b r11

rla.b r11

rla.b r11

rla.b r11 ; Shift to bit 5

mov.b &P1OUT,r15

and.b #0DDh,r15

bis.b r4,r15

bis.b r11,r15

mov.b r15,&P1OUT ; Move to P1.1 and P1.5

dec.b r8 ; One more bit sent

jnz eoisr ; Leave if byte not

; completely sent

inc.b r5 ; Byte complete, point

; to next data byte

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A.1 Microcontroller Program Listing

mov.b send_me_1GHz(r5),r9 ; Copy new "1 GHz

; Synthesizer" data

; byte to r9

mov.b send_me_4GHz(r5),r10 ; Copy new "4 GHz

; Synthesizer" data

; byte to r10

dec.b r12 ; Decrease "bytes left

; in 24 bit word"

; counter

dec.b r7 ; Decrease "total bytes

; left" counter

mov.b #8,r8 ; Reinitialize

eoisr

reti

;*** END OF INTERRUPT SERVICE ROUTINE

;*** EXAMPLE DATA SETS

send_me_1GHz ; Data set for the

; "1 GHz Synthesizer"

DB 10h, 7Fh, 0FDh ; R Divider Register

; MOD=4095, R=1,

; Prescaler=4/5

DB 00h, 0Ch, 62h

DB 00h, 03h, 0C7h

DB 0Dh, 98h, 00h

EVEN ; Ensure even label

; address

send_me_4GHz ; Data set for the

; "4 GHz Synthesizer"

DB 14h, 7Fh, 0FDh ; R Divider Register

DB 00h, 0Fh, 0E2h

DB 00h, 03h, 0C7h

DB 1Ah, 94h, 00h ; N Divider Register

; R Divider Register: MOD=4095, R=1, Prescaler=8/9

; N Divider Register: FRAC=1280, INT=106

;*** END

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A.2 Synthesizer Part List and Placement

A.2 Synthesizer Part List and Placement

C28

R14

R15

R16

L5

C13 C12R4

R2

R3

C11

C14

C15

C16C17

C18

L4

R6

C19

C20

R5

C9

C10

C1C2R1

C3

C4

C5

C6

C7 C8R10

R11

R7 R8 R9

C27

C26

R12

R13

C29

C25 L1

L2

C21

C22

C23

C24

U1

U2

U3

U4

U5

L3

+

+

+

+

+

+

+

+

MEC

CRYSTEK

B B

Figure A.1: Part Placement on the 1087,5 MHz Synthesizer PCB.

71

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A.2 Synthesizer Part List and Placement

Figure A.2: Picture of the LO1 1087,5 MHz Synthesizer PCB.

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A.2 Synthesizer Part List and Placement

Figure A.3: Top Layer Layout of the 1087,5 MHz Synthesizer PCB.

Figure A.4: Ground Plane of the 1087,5 MHz Synthesizer PCB (Bottom View).

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A.2 Synthesizer Part List and Placement

Table A.1: Part List for the f0=1087,5 MHz Synthesizer PCB.

Part Value/Type Land Pattern NotesR1 5100 Ω 0805R2 18 Ω 0603 50R / 3 precisionR3 18 Ω 0603 50R / 3 precisionR4 18 Ω 0603 50R / 3 precisionR5 50 Ω 1206 precisionR6 90 Ω 1206R7 330 Ω 0805R8 330 Ω 0805R9 330 Ω 0805R10 220 Ω 1206R11 220 Ω 1206R12 470 Ω 1206 high precisionR13 470 Ω 1206 high precisionR14 332 Ω 1206 1/4 WR15 332 Ω 1206 1/4 WR16 332 Ω 1206 1/4 WC1 10 pF 0402C2 100 nF 0402C3 10 pF 0402C4 100 nF 0402C5 10 pF 0402C6 100 nF 0402C7 10 pF 0805C8 100 nF 0805C9 100 pF 0603C10 22 pF 0805 series resonance above f0

C11 22 pF 0805 series resonance above f0

C12 22 pF 0805 series resonance above f0

C13 22 pF 0805 series resonance above f0

C14 10 pF 0603C15 100 nF 0603C16 10 nF 0603C17 1 µF tantalumC18 100 nF polyphenylene sulfide film

(PPS)C19 220 nF polyphenylene sulfide film

(PPS)continued on next page

74

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A.2 Synthesizer Part List and Placement

continued from previous page

Part Value/Type Land Pattern NotesC20 220 nF polyphenylene sulfide

film (PPS)C21 1 µF tantalumC22 1 µF tantalumC23 10 µF tantalumC24 10 µF tantalumC25 1 µF tantalumC26 10 µF tantalumC27 10 µF tantalumC28 10 pF 0402C29 10 pF 0402L1 100 µH 1812L2 100 µH 1812L4 100 µH 1812L5 68 nH 0805 RFC; fres < fmax

U1 ADF4153BRU 16 ld TSSOP Analog Devices

U2 MAV-11SM Mini Circuits

U3 BUF634P 8 ld PDIP TI Burr Brown

U4 OC14T5A-10.000-0.1/ OCXO; Mercury

-20+70U5 CVCO55BE-0960-1200 VCO; Crystek

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A.2 Synthesizer Part List and Placement

U1

U2

U3

U4

U5

U6

R1

R2 R3 R4

R5

R6

R7 R8

R9

R10

R11

R13

C1C2

C3

C4

C5

C6

C7 C8

C10C9

R12

C11

C12

C13C14

C15

C16 C17

C18

C19

C20

C21 C22

C23

C24

C25

C26

C27

C28

C29

C30

C31

C32

C33

C34

C35

C36

L1

L2

L3

L4

L5

L6

CRYSTEK

MEC

B B

82

+

+

+

+

+

+

+

+

+

+

Figure A.5: Part Placement on the 4252,5 MHz Synthesizer PCB.

76

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A.2 Synthesizer Part List and Placement

Figure A.6: Picture of the LO2 4252,5 MHz Synthesizer PCB.

77

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A.2 Synthesizer Part List and Placement

Figure A.7: Top Layer Layout of the 4252,5 MHz Synthesizer PCB.

Figure A.8: Ground Plane of the 4252,5 MHz Synthesizer PCB (Bottom View).

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A.2 Synthesizer Part List and Placement

Table A.2: Part List for the f0=4252,5 MHz Synthesizer PCB.

Part Value/Type Land Pattern NotesR1 5100 Ω 0805R2 330 Ω 0805R3 330 Ω 0805R4 330 Ω 0805R5 220 Ω 1206R6 220 Ω 1206R7 18 Ω 0603 50R / 3 precisionR8 18 Ω 0603 50R / 3 precisionR9 18 Ω 0603 50R / 3 precisionR10 470 Ω 1206 high precisionR11 470 Ω 1206 high precisionR12 50 Ω 0603 precisionR13 63 Ω 1206C1 10 pF 0402C2 100 nF 0402C3 10 pF 0402C4 100 nF 0402C5 10 pF 0402C6 100 nF 0402C7 10 pF 0402C8 100 nF 0402C9 100 pF 0603C10 6,8 pF 0603 series resonance above f0/2C11 6,8 pF 0603 series resonance above f0/2C12 10 nF 0402C13 1 nF 0402C14 10 µF tantalumC15 1,8 pF 0603 series resonance above f0

C16 1,8 pF 0603 series resonance above f0

C17 1,8 pF 0603 series resonance above f0

C18 1,8 pF 0603 series resonance above f0

C19 100 pF 1206C20 1 µF tantalumC21 10 pF 0603C22 10 nF 0603C23 100 nF 0603C24 1 µF tantalum

continued on next page

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A.2 Synthesizer Part List and Placement

continued from previous page

Part Value/Type Land Pattern NotesC25 100 nF polyphenylene sulfide film

(PPS)C26 220 nF polyphenylene sulfide film

(PPS)C27 220 nF polyphenylene sulfide film

(PPS)C28 220 nF polyphenylene sulfide film

(PPS)C29 10 µF tantalumC30 10 µF tantalumC31 1 µF tantalumC32 10 µF tantalumC33 1 µF tantalumC34 10 µF tantalumC35 10 pF 0402C36 1 µF tantalumL1 100 µH 1812L2 68 µH 1812L3 68 µH 1812L4 100 µH 1812L5 100 µH 1812L6 22 nH RFCU1 ADF4153BRU 16 ld TSSOP Analog Devices

U2 MGA-82563 SOT-363 Agilent

U3 BUF634P 8 ld PDIP TI Burr Brown

U4 OC14T5A-10.000-0.1/ OCXO; Mercury

-20+70U5 CVCO55BH-4100-4300 VCO; Crystek

U6 HMC432 SOT26 Prescaler ÷2; Hittite

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A.3 Voltage Supply

A.3 Voltage Supply

C1

C2L1 L2

D1

R1

U11

4 5

7-VIN

+VIN+VOUT

-VOUT

U2

VIN

VOUT

ADJ

C3 C4

D2

D6

D7

C6

C5 C7 R2R3

R4

+ +

+

+

+

U3

C8 C9

D3

D8

D9

C10

C11 C12 R5R6

R7

+

+

+

VIN

VOUT

ADJ

U4

C13 C14

D4

D10

D11

C15

C16 C17 R8R9

R10

+

+

+

VIN

VOUT

ADJ

D5

+12,0V IN

-12,0V OUT

+3,0V OUT

+4,4V OUT

+5,0V OUT

NME1212D

LM317T

LM317T

LM317T

Figure A.9: Voltage Supply Schematics.

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A.3 Voltage Supply

C1

C2

C3

C4C5

C6

C7

C8

C9

C10

C11

C12

C13

C14

C15

C16

C17

L1

L2

R1

D1

U1

U2

D2

D6

D7

R2

R3

R4

D5

U3D8

D9

R6

R7

R5

D3

U4D10

D11

R9

R10

R8

D4

+

+

+

+

+

+

+

+

+

+

+

-12.0V

+3.0V

+4.4V

+5.0V

12V DC IN

NME

Figure A.10: Part Placement on the Voltage Supply PCB.

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A.3 Voltage Supply

Figure A.11: DC Regulator PCB Layout: Top Layer (left), Ground Plane (right).

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A.3 Voltage Supply

Table A.3: Part List for the Voltage Supply PCB.

Part Value/Type Land Pattern NotesR1 800 Ω 0805R2 200 Ω 0805R3 100 Ω 1206 precisionR4 140 Ω 1206 precisionR5 293 Ω 0805R6 100 Ω 1206 precisionR7 252 Ω 1206 precisionR8 330 Ω 0805R9 100 Ω 1206 precisionR10 300 Ω 1206 precisionC1 1 µF tantalumC2 1 µF tantalumC3 47 µFC4 100 nF 0402C5 100 nF 0402C6 10 µFC7 47 µFC8 47 µFC9 100 nF 0402C10 10 µFC11 100 nF 0402C12 47 µFC13 47 µFC14 100 nF 0402C15 10 µFC16 100 nF 0402C17 47 µFL1 220 µH 1812L2 220 µH 1812D1 0603 LEDD2 0603 LED, ensures a minimum loadD3 0603 LED, ensures a minimum loadD4 0603 LED, ensures a minimum loadD5 MRA4003T3 ON Semiconductor

D6 MRA4003T3 ON Semiconductor

D7 MRA4003T3 ON Semiconductor

D8 MRA4003T3 ON Semiconductor

continued on next page

84

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A.3 Voltage Supply

continued from previous page

Part Value/Type Package NotesD9 MRA4003T3 ON Semiconductor

D10 MRA4003T3 ON Semiconductor

D11 MRA4003T3 ON Semiconductor

U1 NME1212D C&D Technologies; DC-DC converterU2 LM317T TO220 apply heatsink, max. 14 K/WU3 LM317T TO220 apply heatsink, max. 200 K/WU4 LM317T TO220 apply heatsink, max. 7,8 K/W

Figure A.12: Picture of the Voltage Supply PCB.

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Bibliography

[1] Floyd M. Gardner, Phaselock Techniques, John Wiley & Sons, Inc.Wiley-Interscience, 1979

[2] Roland Best, Theorie und Anwendungen des Phase-locked Loops, 5. Neu-auflage der Ausgabe 1987, AT-Verlag Aarau/Schweiz, 1993

[3] Ulrich L. Rohde, Microwave and Wireless Synthesizers: Theory and Design,Wiley-Interscience, October 1997

[4] Analog Devices, ADF4153 PLL Frequency Synthesizer, data sheet, Rev. A

[5] Analog Devices, ADF4153 PLL Frequency Synthesizer, data sheet, Rev. Bhttp://www.analog.com/UploadedFiles/Data Sheets/ADF4153.pdf

[6] Analog Devices, Evaluation Board For Fractional-N PLL Frequency Synthe-sizer, tech notehttp://www.analog.com/Analog Root/static/techSupport/designTools/

evaluationBoards/downloads/EVAL-ADF4153EB1 PRB.pdf

[7] Analog Devices, ADF4252 Dual Fractional-N/Integer-N Frequency Synthe-sizer, data sheethttp://www.analog.com/UploadedFiles/Data Sheets/ADF4252.pdf

[8] National Semiconductor, LMX2470 2.6 GHz Delta-Sigma Fractional-N PLLwith 800 MHz Integer-N PLL, data sheethttp://www.national.com/ds/LM/LMX2470.pdf

[9] National Semiconductor, LMX2471 3.6 GHz Delta-Sigma Fractional-N PLLwith 1.7 GHz Integer-N PLL, data sheethttp://www.national.com/ds/LM/LMX2471.pdf

[10] Mercury, OC14T5A OCXO Oven Controlled Crystal Oscillator, data sheethttp://www.mecxtal.com/pdf/OC14T5A OC14T5GA.pdf

[11] Burr-Brown/Texas Instruments, BUF634 250 mA High-Speed Buffer, datasheethttp://focus.ti.com/lit/ds/symlink/buf634.pdf

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[12] Crystek Crystals Corporation, CVCO55BE-0960-1200 Voltage ControlledOscillator — VCO, data sheethttp://www.crystek.com/spec-sheets/vco/cvco55/CVCO55BE-0960-1200.pdf

[13] Mini Circuits, MAV-11SM Surface Mount Monolithic Amplifier, data sheethttp://www.minicircuits.com/pdfs/MAV-11SM+.pdf

[14] Mini Circuits, AN-60-010 Improved ERA amplifiers, application notehttp://www.minicircuits.com/pages/pdfs/an60010.pdf

[15] Crystek Crystals Corporation, CVCO55BH-4100-4300 Voltage ControlledOscillator — VCO, data sheethttp://www.crystek.com/spec-sheets/vco/cvco55/CVCO55BH-4100-4300.pdf

[16] Hittite, SMT GaAs HBT MMIC DIVIDE-BY-2, DC - 8.0 GHz, data sheethttp://www.hittite.com/product info/product specs/dividersdetectors/hmc432.pdf

[17] Agilent/Avago, MGA-82563 0.1– 6 GHz 3V, 17 dBm Amplifier, data sheethttp://www.avagotech.com/assets/downloadDocument.do?id=2621

[18] Rogers Corporation, RO4000 Series High Frequency Circuit Materials,data sheethttp://www.rogerscorporation.com/mwu/pdf/ro4000ds 4.pdf

[19] C&D Technologies, NME 5V & 12V SERIES Isolated 1W Single OutputDC/DC Converters, data sheethttp://www.cd4power.com/data/power/ncl/kdc nme.pdf

[20] National Semiconductor, LM117/LM317A/LM317 3-Terminal AdjustableRegulator, data sheethttp://cache.national.com/ds/LM/LM117.pdf

[21] Texas Instruments, MSP430x13x, MSP430x14x, MSP430x14x1: Mixed Sig-nal Microcontroller (Rev. F), data sheethttp://www.ti.com/lit/gpn/msp430f149

[22] Texas Instruments, MSP-FET430 Flash Emulation Tool (FET) (For usewith IAR v3.x) User’s Guide (Rev. G)http://www.ti.com/litv/pdf/slau138g

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List of Abbreviations

BALUN Balanced–Unbalanced Converter

BPF Band Pass Filter

CMOS Complementary Metal-Oxide-Semiconductor

DC Direct Current

EFC Electronic Frequency Control

FR4 Flame Resistant 4

IF Intermediate Frequency

ISR Interrupt Service Routine

JTAG Joint Test Action Group

LE Latch Enable

LNA Low Noise Amplifier

LO Local Oscillator

LPM Low Power Mode

LSB Least Significant Bit

MIMO Multiple Input Multiple Output

MSB Most Significant Bit

OCXO Oven Controlled X-tal (Crystal) Oscillator

PCB Printed Circuit Board

PFD Phase Frequency Detector

PHEMT Pseudomorphic High Electron Mobility Transistor

PLL Phase-Locked Loop

RF Radio Frequency

RFC Radio Frequency Coil (Choke)

RMS Root Mean Square

SMB Sub-Miniature B Connector

SMD Surface Mounted Device

SSB Single Sideband

VCO Voltage Controlled Oscillator

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List of Symbols

C Capacitance

D Frequency Scaler Multiplication Factor

∆θ Phase Differential

εr Relative Permittivity

F Modulus

fPFD Frequency at Phase Frequency Detector Input

fref Reference Oscillator Frequency

fstep Frequency Step Size

G(s) Open Loop Gain

H Divider Transfer Function

K Fraction

Kφ Phase Detector Sensitivity [mA · rad−1]

KV CO Tuning Sensitivity [MHz/V]

L Inductance

N Integer Frequency Division Factor

Ntot Average Frequency Division Factor

φ Phase, Phase Margin

R Frequency Scaler Division Factor

Ri Ohmic Resistance

s Laplace Frequency Variable

Sij Scattering Parameter

T Time Constant

U Voltage

ωc Loop Bandwidth

V Prescaler Frequency Division Factor

w Microstrip Line Width

Z(s) Loop Filter Transfer Function

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List of Figures

1.1 Ideal Mixer. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41.2 Signal Spectra for Upconversion. . . . . . . . . . . . . . . . . . . . 41.3 Signal Spectra for Downconversion. . . . . . . . . . . . . . . . . . 51.4 Channel Raster. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51.5 Proposed Transmitter and Receiver (1 Channel). . . . . . . . . . . 61.6 System for 8 × 8 - MIMO. . . . . . . . . . . . . . . . . . . . . . . 71.7 Frequency Synthesizer Components. . . . . . . . . . . . . . . . . . 81.8 Block Diagram of the Main PCB. . . . . . . . . . . . . . . . . . . 91.9 Picture of the Voltage Supply PCB. . . . . . . . . . . . . . . . . . 10

2.1 Basic PLL Elements. . . . . . . . . . . . . . . . . . . . . . . . . . 112.2 PLL Frequency Synthesizer Elements. . . . . . . . . . . . . . . . . 152.3 PLL Synthesizer with Prescaler. . . . . . . . . . . . . . . . . . . . 182.4 Topology of the Passive Second Order Loop Filter. . . . . . . . . 222.5 The Phase-Locked Loop System. . . . . . . . . . . . . . . . . . . . 22

3.1 Picture of the LO1 1087,5 MHz Synthesizer PCB. . . . . . . . . . 253.2 PCB Overview of the 1087,5 MHz Synthesizer. . . . . . . . . . . . 273.3 Biasing the MAV-11SM Amplifier. . . . . . . . . . . . . . . . . . . 323.4 Top Layer Layout of the 1087,5 MHz Synthesizer PCB. . . . . . . 373.5 Schematic of the 1087,5 MHz Synthesizer PCB. . . . . . . . . . . 38

4.1 Picture of the LO2 4252,5 MHz Synthesizer PCB. . . . . . . . . . 394.2 PCB Overview of the 4252,5 MHz Synthesizer. . . . . . . . . . . . 414.3 Top Layer Layout of the 4252,5 MHz Synthesizer PCB. . . . . . . 474.4 Schematic of the 4252,5 MHz Synthesizer PCB. . . . . . . . . . . 48

5.1 N Divider Register Map. . . . . . . . . . . . . . . . . . . . . . . . 505.2 R Divider Register Map. . . . . . . . . . . . . . . . . . . . . . . . 505.3 Control Register Map. . . . . . . . . . . . . . . . . . . . . . . . . 515.4 Noise and Spur Register Map. . . . . . . . . . . . . . . . . . . . . 515.5 ADF4153 3-Wire Interface Timings. . . . . . . . . . . . . . . . . . 52

6.1 Synthesizer Component Arrangement within the 19-Inch Enclosure. 576.2 Synthesizer Hardware Setup for Measurement of LO1. . . . . . . . 586.3 Measured LO1 Spectrum: RBW=100Hz, Lowest Noise Mode. . . 60

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6.4 Calculated LO1 Power Spectral Density: Lowest Noise Mode. . . 606.5 Measured LO2 Spectrum: RBW=100Hz, Lowest Noise Mode. . . 626.6 Calculated LO2 Power Spectral Density: Lowest Noise Mode. . . 626.7 Measured LO2 Lowest Noise vs Lowest Spur Mode: RBW=100Hz. 636.8 Measured LO2 Spectra in Lowest Noise Mode: RBW=100Hz. . . 63

A.1 Part Placement on the 1087,5 MHz Synthesizer PCB. . . . . . . . 71A.2 Picture of the LO1 1087,5 MHz Synthesizer PCB. . . . . . . . . . 72A.3 Top Layer Layout of the 1087,5 MHz Synthesizer PCB. . . . . . . 73A.4 Ground Plane of the 1087,5 MHz Synthesizer PCB (Bottom View). 73A.5 Part Placement on the 4252,5 MHz Synthesizer PCB. . . . . . . . 76A.6 Picture of the LO2 4252,5 MHz Synthesizer PCB. . . . . . . . . . 77A.7 Top Layer Layout of the 4252,5 MHz Synthesizer PCB. . . . . . . 78A.8 Ground Plane of the 4252,5 MHz Synthesizer PCB (Bottom View). 78A.9 Voltage Supply Schematics. . . . . . . . . . . . . . . . . . . . . . 81A.10 Part Placement on the Voltage Supply PCB. . . . . . . . . . . . . 82A.11 DC Regulator PCB Layout: Top Layer (left), Ground Plane (right). 83A.12 Picture of the Voltage Supply PCB. . . . . . . . . . . . . . . . . . 85

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List of Tables

2.1 Fractional-N PLL IC Comparison. . . . . . . . . . . . . . . . . . . 192.2 ADF4153 Fractional-N PLL IC Specifications. . . . . . . . . . . . 21

3.1 LO1 Requirements. . . . . . . . . . . . . . . . . . . . . . . . . . . 263.2 Mercury OC14T5A OCXO Specifications. . . . . . . . . . . . . . 283.3 Burr-Brown BUF634 Specifications for ”Wide Bandwidth Mode”. 303.4 Crystek CVCO55BE-0960-1200 VCO Specifications. . . . . . . . . 303.5 MAV-11SM Scattering Parameters. . . . . . . . . . . . . . . . . . 313.6 Properties of the FR4 Circuit Board. . . . . . . . . . . . . . . . . 35

4.1 LO2 Requirements. . . . . . . . . . . . . . . . . . . . . . . . . . . 404.2 Crystek CVCO55BH-4100-4300 VCO Specifications. . . . . . . . . 424.3 Hittite HMC432 Divide-By-2 Specifications. . . . . . . . . . . . . 434.4 Agilent MGA-82563 Amplifier Specifications. . . . . . . . . . . . . 434.5 MGA-82563 Typical Scattering Parameters. . . . . . . . . . . . . 444.6 Properties of the RO4003C 0.032” Circuit Board Material. . . . . 46

5.1 Truth Table of the Control Bits C2 and C1. . . . . . . . . . . . . 495.2 Mapping: Controller Ports to 3-Wire Interface. . . . . . . . . . . . 56

A.1 Part List for the f0=1087,5 MHz Synthesizer PCB. . . . . . . . . 74A.2 Part List for the f0=4252,5 MHz Synthesizer PCB. . . . . . . . . 79A.3 Part List for the Voltage Supply PCB. . . . . . . . . . . . . . . . 84

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